2SD2374AP PANASONIC

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  • Manufacturer or author: Provided By digicamel.com
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Technical content

1Publication date: March 2004 SJD00261BED 2SD2374A Silicon NPN triple diffusion planar type For power amplification Complementary to 2SB1548A ■ Features

  • High forward current transfer ratio hFE which has satisfactory lin- earity
  • Low collector-emitter saturation voltage VCE(sat)
  • Full-pack package which can be installed to the heat sink with one screw ■ Absolute Maximum Ratings Ta = 25°C ■ Electrical Characteristics Ta = 25°C ± 3°C 1.4±0.2 1.6±0.2 0.8±0.1 0.55±0.15 2.54±0.30 5.08±0.50 123 2.6±0.1 2.9±0.2 4.6±0.2 φ 3.2±0.1 3.0±0.5 9.9±0.3 15.0±0.513.7±0.2 4.2±0.2 Solder Dip Unit: mm Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V CBO 80 V Collector-emitter voltage (Base open) V CEO 80 V Emitter-base voltage (Collector open) V EBO 6V Collector current I C 3A Peak collector current I CP 5A Collector power TC = 25°CP C 25 W dissipation 2.0 Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C 1: Base 2: Collector 3: Emitter Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank Q P hFE1 70 to 150 120 to 250 Parameter Symbol Conditions Min Typ Max Unit Collector-emitter voltage (Base open) V CEO IC = 30 mA, IB = 08 0V Base-emitter voltage V BE VCE = 4 V, IC = 3 A 1.8 V Collector-emitter cutoff current (E-B short) ICES VCE = 80 V, VBE = 0 200 µA Collector-emitter cutoff current (Base open) ICEO VCE = 60 V, IB = 0 300 µA Emitter-base cutoff current (Collector open) IEBO VEB = 6 V, IC = 01 m A Forward current transfer ratio h FE1 * VCE = 4 V, IC = 1 A 70 250  hFE2 VCE = 4 V, IC = 3 A 10 Collector-emitter saturation voltage V CE(sat) IC = 3 A, IB = 0.375 A 1.2 V Transition frequency f T VCE = 10 V, IC = 0.5 A, f = 10 MHz 30 MHz Turn-on time t on IC = 1 A, IB1 = 0.1 A, IB2 = − 0.1 A 0.5 µs Storage time t stg VCC = 50 V 2.5 µs Fall time t f 0.4 µs This product complies with the RoHS Directive (EU 2002/95/EC). Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

2 SJD00261BED

VCE(sat)  IC hFE  IC fT  IC PC  Ta IC  VCE IC  VBE Safe operation area R th  t 0 160 40 120 80 Collector power dissipation PC (W) Ambient temperature Ta (°C) (1)TC=Ta (2)Without heat sink (PC=2W) (1) (2) 01 2 21 0 48 6 Collector current IC (A) Collector-emitter voltage VCE (V) IB=100mA 10mA 20mA 30mA 40mA 50mA 60mA 70mA 80mA 90mA TC=25˚C Base-emitter voltage VBE (V) Collector current IC (A) VCE=4V TC=25˚C 0.001 0.01 0.01 0.1 0.1 1 10 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (A) IC/IB=8 TC=25˚C 0.01 0.1 1 10 102 103 104 Forward current transfer ratio hFE Collector current IC (A) VCE=4V TC=25˚C 0.01 0.1 1 10 0.1 100 1 000 Collector current IC (A) Transition frequency fT (MHz) VCE=10V f=10MHz TC=25˚C 0.01 0.1 100 10 100 1 000 Collector current IC (A) Collector-emitter voltage VCE (V) ICP IC t=10ms t=1ms t=1s 2SD2374 2SD2374A Non repetitive pulse T C=25˚C 10−2 10−1 102 103 103 10410210110−110−3 10−210−4 Time t (s) Thermal resistance Rth (°C/W) (1) Ta=25˚C (2) (1)Without heat sink (2)With a 100×80×2mm Al heat sink This product complies with the RoHS Directive (EU 2002/95/EC). Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/