2SD1264A-P PANASONIC

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Technical content

1Publication date: April 2003 SJD00180BED 2SD1264, 2SD1264A Silicon NPN triple diffusion planar type For low-frequency power amplification For TV vertical deflection output Complementary to 2SB0940, 2S0940A ■ Features

  • High collector-emitter voltage (Base open) VCEO
  • Large collector power dissipation PC
  • Full-pack package which can be installed to the heat sink with one screw ■ Absolute Maximum Ratings Ta = 25°C ■ Electrical Characteristics Ta = 25°C ± 3°C Unit: mm 1: Base 2: Collector 3: Emitter EIAJ: SC-67 Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank Q P hFE1 60 to 140 100 to 240 Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 200 V Collector-emitter voltage 2SD1264 V CEO 150 V (Base open) 2SD1264A 180 Emitter-base voltage (Collector open) V EBO 6V Collector current I C 2A Peak collector current I CP 3A Collector power T C = 25°CP C 30 W dissipation 2.0 Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO IC = 50 µA, IE = 0 200 V Collector-emitter voltage 2SD1264 V CEO IC = 5 mA, IB = 0 150 V (Base open) 2SD1264A 180 Emitter-base voltage (Collector open) V EBO IE = 500 µA, IC = 06 V Base-emitter voltage V BE VCE = 10 V, IC = 400 mA 1.0 V Collector-base cutoff current (Emitter open) ICBO VCB = 200 V, IE = 05 0 µA Emitter-base cutoff current (Collector open) IEBO VEB = 4 V, IC = 05 0 µA Forward current transfer ratio h FE1 * VCE = 10 V, IC = 150 mA 60 240  hFE2 VCE = 10 V, IC = 400 mA 50 Collector-emitter saturation voltage V CE(sat) IC = 500 mA, IB = 50 mA 1.0 V Transition frequency f T VCE = 10 V, IC = 0.5 A, f = 1 MHz 20 MHz 10.0±0.2 5.5±0.2 7.5±0.2 16.7±0.3 0.7±0.1 14.0±0.5 Solder Dip (4.0) 0.5+0.2 –0.1 1.4±0.1 1.3±0.2 0.8±0.1 2.54±0.3 5.08±0.5 213 2.7±0.2 4.2±0.2 4.2±0.2 φ 3.1±0.1 Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

2SD1264, 2SD1264A

2 SJD00180BED

VCE(sat)  IC hFE  IC fT  IC PC  Ta IC  VCE IC  VBE Safe operation area R th  t 0 160 40 120 80 Collector power dissipation PC (W) Ambient temperature Ta (°C) (1)TC=Ta (2)With a 100×100×2mm Al heat sink (3)With a 50×50×2mm Al heat sink (4)Without heat sink (PC=2W)(1) (2) (3) (4) 02 4 42 0 81 6 12 1.2 1.0 0.8 0.6 0.4 0.2 Collector current IC (A) Collector-emitter voltage VCE (V) IB=7mA 6mA 5mA 4mA 3mA 2mA 1mA TC=25˚C 1.2 1.0 0.8 0.6 0.4 0.2 Base-emitter voltage VBE (V) Collector current IC (A) TC=100˚C 25˚C –25˚C 0.01 0.1 1 0.01 0.1 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (A) IC/IB=10 TC=100˚C 25˚C –25˚C 0.01 0.1 1 10 102 103 104 Forward current transfer ratio hFE Collector current IC (A) VCE=10V 25˚C –25˚C TC=100˚C 0.01 0.1 1 10 0.1 100 1 000 Collector current IC (A) Transition frequency fT (MHz) VCE=5V f=1MHz TC=25˚C 0.001 0.01 0.1 10 100 1 000 Collector current IC (A) Collector-emitter voltage VCE (V) Non repetitive pulse T C=25˚CICP IC t=5ms t=1ms DC t=0.5ms2SD1264 2SD1264A 10−2 10−1 103 102 103 10410210110−110−3 10−210−4 Time t (s) Thermal resistance Rth (°C/W) (1) (2) (1)Without heat sink (2)With a 100×100×2mm Al heat sink Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/