Download PDF2SC584500L PANASONIC
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1Publication date: August 2003 SJC00297AED 2SC5845 Silicon NPN epitaxial planar type For general amplification ■ Features
- High forward current transfer ratio hFE
- Mini type package, allowing downsizing of the equipment and au- tomatic insertion through the tape packing and the magazine pack- ing ■ Absolute Maximum Ratings Ta = 25°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO IC = 10 µΑ, IE = 06 0 V Collector-emitter voltage (Base open) V CEO IC = 2 mA, IB = 05 0 V Emitter-base voltage (Collector open) V EBO IE = 10 µΑ, IC = 07V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = 10 V, IB = 0 100 µA Forward current transfer ratio h FE VCE = 10 V, IC = 2 mA 160 460 Collector-emitter saturation voltage V CE(sat) IC = 100 mA, IB = 10 mA 0.1 0.3 V Collector output capacitance C ob VCB = 10 V, IE = 0, f = 1 MHz 2.2 pF (Common base, input open circuited) Transition frequency f T VCB = 10 V, IE = −2 mA, f = 200 MHz 100 MHz ■ Electrical Characteristics Ta = 25°C ± 3°C Unit: mm Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V CBO 60 V Collector-emitter voltage (Base open) V CEO 50 V Emitter-base voltage (Collector open) V EBO 7V Collector current I C 100 mA Peak collector current I CP 200 mA Collector power dissipation P C 200 mW Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Marking Symbol: 7M 0.40+0.10 –0.05 (0.65) 1.50+0.25 –0.05 2.8+0.2 –0.3 (0.95) (0.95) 1.9±0.1 2.90+0.20 –0.05 0.16+0.10 –0.06 0.4±0.2 10˚ 0 to 0.1 1.1+0.2 –0.11.1+0.3 –0.1 1: Base 2: Emitter 3: Collector EIAJ: SC-59 Mini3-G1 Package Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. This product complies with the RoHS Directive (EU 2002/95/EC). Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/
2 SJC00297AED
IC VBE IB VBE VCE(sat) IC PC Ta IC VCE IC IB hFE IC Cob VCB 0 160 40 120 80 240 200 160 120 Collector power dissipation PC (mW) Ambient temperature Ta (°C) 04 26 8 1 0 1 2 Collector current IC (mA) Collector-emitter voltage VCE (V) IB = 160 µA 140 µA 100 µA 80 µA 60 µA 40 µA 20 µA 120 µA Ta = 25°C 140 120 100 Collector current IC (mA) Base current IB (mA) VCE = 10V Ta = 25°C 100 120 Collector current IC (mA) Base-emitter voltage VBE (V) VCE = 10V Ta = 75°C –25°C 25°C 0 0.2 0.4 0.6 0.8 3.5 0.5 1.0 1.5 2.0 2.5 3.0 Base current IB (mA) Base-emitter voltage VBE (V) VCE = 10V Ta = 25°C 1 10 100 0.01 0.1 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) Ta = 75°C –25°C 25°C IC / IB = 10 1 10 100 1 000 100 150 200 250 300 350 Collector current IC (mA) Forward current transfer ratio hFE Ta = 75°C –25°C 25°C VCE = 10V 01 6 82 4 3 2 4 0 Collector-base voltage VCB (V) Collector output capacitance (Common base, input open circuited) Cob (pF) f = 1 MHz Ta = 25°C This product complies with the RoHS Directive (EU 2002/95/EC). Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/