2SB0951 PANASONIC

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 4

Technical content

1Publication date: April 2003 SJD00030BED 2SB0951 (2SB951), 2SB0951A (2SB951A) Silicon PNP epitaxial planar type darlington For midium-speed switching Complementary to 2SD1277 and 2SD1277A ■ Features

  • High forward current transfer ratio hFE
  • High-speed switching
  • Full-pack package which can be installed to the heat sink with one screw ■ Absolute Maximum Ratings TC = 25°C ■ Electrical Characteristics TC = 25°C ± 3°C Unit: mm 1: Base 2: Collector 3: Emitter EIAJ: SC-67 Parameter Symbol Rating Unit Collector-base voltage 2SB0951 V CBO −60 V (Emitter open) 2SB0951A −80 Collector-emitter voltage 2SB0951 V CEO −60 V (Base open) 2SB0951A −80 Emitter-base voltage (Collector open) V EBO −7V Collector current I C −8A Peak collector current I CP −12 A Collector power P C 45 W dissipation T a = 25°C2 Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Parameter Symbol Conditions Min Typ Max Unit Collector-emitter voltage 2SB0951 V CEO IC = −30 mA, IB = 0 −60 V (Base open) 2SB0951A −80 Collector-base cutoff 2SB0951 I CBO VCB = −60 V, IE = 0 −100 µA current (Emitter open) 2SB0951A V CB = −80 V, IE = 0 −100 Emitter-base cutoff current (Collector open) IEBO VEB = −7 V, IC = 0 −2m A Forward current transfer ratio h FE1 * VCE = −3 V, IC = −4 A 1 000 10 000  hFE2 VCE = −3 V, IC = −8 A 500 Collector-emitter saturation voltage V CE(sat) IC = −4 A, IB = −8 mA −1.5 V Base-emitter saturation voltage V BE(sat) IC = −4 A, IB = −8 mA −2.0 V Transition frequency f T VCE = −10 V, IC = −1 A, f = 1 MHz 20 MHz Turn-on time t on IC = −4 A, IB1 = −8 mA, IB2 = 8 mA 0.5 µs Storage time t stg VCC = −50 V 2.0 µs Fall time t f 1.0 µs Note) The part numbers in the parenthesis show conventional part number. 10.0±0.2 5.5±0.2 7.5±0.2 16.7±0.3 0.7±0.1 14.0±0.5 Solder Dip (4.0) 0.5+0.2 –0.1 1.4±0.1 1.3±0.2 0.8±0.1 2.54±0.3 5.08±0.5 213 2.7±0.2 4.2±0.2 4.2±0.2 φ 3.1±0.1 Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank R Q P hFE1 1 000 to 2 500 2 000 to 5 000 4 000 to 10 000 Internal Connection B C E

2SB0951, 2SB0951A

2 SJD00030BED

VCE(sat)  IC VBE(sat)  IC VBE(sat)  IC PC  Ta IC  VCE VCE(sat)  IC 0 160 40 120 80 Collector power dissipation PC (W) Ambient temperature Ta (°C) (1)TC=Ta (2)With a 100×100×2mm Al heat sink (3)With a 50×50×2mm Al heat sink (4)Without heat sink (PC=2W) (1) (4) (3) (2) IB=–2.0mA –1.8mA –1.6mA –1.4mA –1.2mA –1.0mA –0.8mA –0.6mA –0.4mA –0.2mA TC=25˚C Collector current IC (A) Collector-emitter voltage VCE (V) − 0.1 −10 −100 − 0.1 −1 −10 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (A) IC/IB=500 TC=100˚C –25˚C 25˚C − 0.1 − 0.1 −10 −100 −1 −10 Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (A) (1) IC/IB=250 (2) IC/IB=500 (3) IC/IB=1000 TC=25 C (1) (2) (3) − 0.01 − 0.1 −1 −10 −10 −100 Base-emitter saturation voltage VBE(sat) (V) Collector current IC (A) IC/IB=500 TC=–25˚C 25˚C 100˚C − 0.1 − 0.1 −1 −10 −10 −100 (1) (2) (3) (1)IC/IB=250 (2)IC/IB=500 (3)IC/IB=1000 TC=25˚C Base-emitter saturation voltage VBE(sat) (V) Collector current IC (A) − 0.1 −1 −10 102 105 104 103 VCE=–3V TC=100˚C 25˚C –25˚C Forward current transfer ratio hFE Collector current IC (A) hFE  IC Cob  VCB Safe operation area − 0.1 −1 −10 −100 IE=0 f=1MHz T C=25˚C 102 103 104 Collector output capacitance (Common base, input open circuited) Cob (pF) Collector-base voltage VCB (V) Collector current IC (A) Collector-emitter voltage VCE (V) − 0.01 − 0.1 −10 −100 −10 −100 −1 000 t=1ms t=10ms ICP IC 2SB0951A 2SB0951 Non repetitive pulse TC=25˚C DC

2SB0951, 2SB0951A 3SJD00030BED Rth  t 10−2 10−1 103 102 10−4 10410310210110−110−210−3 Time t (s) Thermal resistance Rth (°C/W) (1) (2) (1)Without heat sink (2)With a 100×100×2mm Al heat sink

Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. It neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). Consult our sales staff in advance for information on the following applications:

  • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
  • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other- wise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL