2SB0642 PANASONIC

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  • Manufacturer or author: Provided By digicamel.com
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Technical content

1Publication date: January 2003 SJC00045BED 2SB0642 (2SB642) Silicon PNP epitaxial planar type For low-power general amplification ■ Features

  • High forward current transfer ratio hFE
  • M type package allowing easy automatic and manual insertion as well as stand-alone fixing to the printed circuit board. ■ Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V CBO −60 V Collector-emitter voltage (Base open) V CEO −50 V Emitter-base voltage (Collector open) V EBO −7V Collector current I C −100 mA Peak collector current I CP −200 mA Collector power dissipation P C 400 mW Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO IC = −10 µA, IE = 0 −60 V Collector-emitter voltage (Base open) V CEO IC = −2 mA, IB = 0 −50 V Emitter-base voltage (Collector open) V EBO IE = −10 µA, IC = 0 −7V Collector-base cutoff current (Emitter open) ICBO VCB = −20 V, IE = 0 −1 µA Collector-emitter cutoff current (Base open) ICEO VCE = −20 V, IB = 0 −1 µA Forward current transfer ratio * hFE VCE = −10 V, IC = −2 mA 160 460  Collector-emitter saturation voltage V CE(sat) IC = −100 mA, IB = −10 mA −1V Transition frequency f T VCB = −10 V, IE = 2 mA, f = 200 MHz 80 MHz Collector output capacitance C ob VCB = −10 V, IE = 0, f = 1 MHz 3.5 pF (Common-emitter reverse transfer) ■ Electrical Characteristics Ta = 25°C ± 3°C Unit: mm 1: Base 2: Collector 3: Emitter Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Note) The part number in the parenthesis shows conventional part number. Rank Q R S hFE1 160 to 260 210 to 340 290 to 460 6.9±0.1 2.5±0.1 (1.0) (1.0) (1.5) (0.85) 0.45±0.05 0.55±0.1 (2.5)(2.5) 213 R 0.7 R 0.9 (0.4) 3.5±0.1 4.5±0.14.1±0.2 2.4±0.21.25±0.05 2.0±0.2 1.0±0.1 (1.5)

2 SJC00045BED

IB  VBE IC  VBE VCE(sat)  IC PC  Ta IC  VCE IC  IB 0 160 40 120 80 14020 100 60 500 400 300 200 100 Collector power dissipation PC (mW) Ambient temperature Ta (°C) −60 −50 −40 −30 −20 −10 Ta = 25°C IB = −300 µA −250 µA −200 µA −150 µA −100 µA −50 µA Collector current IC (mA) Collector-emitter voltage VCE (V) 0 −450−150 −300 −60 −50 −40 −30 −20 −10 VCE = −5 V Ta = 25°C Base current IB (µA) Collector current IC (mA) hFE  IC fT  IE Cob  VCB 0 −1.8− 0.6 − 1.2 −400 −300 −100 −250 −350 −200 −50 −150 VCE = −5 V Ta = 25°C Base-emitter voltage VBE (V) Base current IB (µA) −240 −200 −160 −120 −80 −40 VCE = −5 V Ta = 75°C −25°C 25°C Base-emitter voltage VBE (V) Collector current IC (mA) −1 −10 −100 −1 000 − 0.001 − 0.01 − 0.1 −10 IC / IB = 10 25°C −25°C Ta = 75°C Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) −1 −10 −100 IE = 0 f = 1 MHz Ta = 25°C Collector-base voltage VCB (V) Collector output capacitance (Common base, input open circuited) Cob (pF) 0.1 1 10 100 160 120 100 140 VCB = −10 V Ta = 25°C Transition frequency fT (MHz) Emitter current IE (mA) −1 −10 −100 −1 000 600 500 400 300 200 100 VCE = −10 V Ta = 75°C 25°C −25°C Forward current transfer ratio hFE Collector current IC (mA)

h Parameter  IE h Parameter  VCE ICBO  Ta Cre  VCE NF  IE NF  IE IC = −1 mA f = 10.7 MHz Ta = 25°C Collector to emitter voltage VCE (V) Common emitter reverse transfer capacitance Cre (pF) 0.01 0.1 1 10 VCB = −5 V f = 1 kHz Rg = 2 kΩ Ta = 25°C Noise figure NF (dB) Emitter current IE (mA) 0.1 1 10 VCB = −5 V Rg = 50 kΩ Ta = 25°C f = 100 Hz 10 kHz 1 kHz Noise figure NF (dB) Emitter current IE (mA) 0 150 12510025 75 50 100 VCB = −10 V Ambient temperature Ta (°C) ICBO (Ta) ICBO (Ta = 25°C) −1 −10 −100 100 IE = 2 mA f = 270 Hz Ta = 25°C hfe hoe (µS) hie (kΩ) hre (× 10−4) h Parameter Collector-emitter voltage VCE (V) 0.1 1 10 100 VCE = −5 V f = 270 Hz Ta = 25°C hfe hoe (µS) hie (kΩ) hre (× 10−4) h Parameter Emitter current IE (mA)

Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. It neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). Consult our sales staff in advance for information on the following applications:

  • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
  • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other- wise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL