2RA-5 LEIDITECH

Document overview

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Technical content

Description

GDT is placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations. These devices do not influence the signal in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment. Our GDT offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as Main Distribution Frame (MDF) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PolySwitch devices, they can help equipment manufacturers meet stringent safety regulatory standards. Electrical symbol Features Applications l Excellent response to fast rising transients l Stable breakdown voltage l GHz working frequency l 8/20μs Impulse current capability: 5KA l Non-Radioactive l Ultra Low capacitance (<1pF) l Lead-free and RoHS compliant l UL 497B Recognized: E465335 l Size: Ф5.5mm*6mm l Storage and operational temperature: -40~+90°C l CATV equipment l Antennas l RS 485 l Telecom Base Station l Power Supply AC Main l EV power Charging l Inverter/Variable l Frequency Drivers (VFDs) l IEEE 802.3 compliant Ethernet interfaces l Broad Band equipment l xDSL, ADSL, ADSL2, VDSL, and VDSL2 l Medical Electronics l Test Equipment l General Telecom Equipment l Renewable Energy Gas Discharge Tube 2RA-5 Series Part Number Code Electrode Numbers 2R: 2 Electrodes Product Series Size: Ф5.5mm*6mm DC Spark-over Voltage

2 R x x x A - 5

8/20μs Impulse Current A: 5KA x Lead Type T: Lead S: SMD Rev : www.leiditech.com 01.06.2015 1/5 ROHS

Electrical Characteristics

Voltage 1) 2) @100V/S Impulse Spark-over Voltage Insulation Resistance Capacitance @1MHz Life Ratings Impulse Discharge Current @8/20μS AC Discharge Current @50Hz 1S Impulse Life @10/1000μS 100A 100V/μS 1KV/μS Max Max Min Max Nominal ±5 times Max 1 time Nominal 5 times Min DIP SMD V V V GΩ pF KA KA A Times 2R075TA-5 2R075SA-5 75±20% 500 600 1 1 5 6 5 300 2R090TA-5 2R090SA-5 90±20% 500 600 1 1 5 6 5 300 2R150TA-5 2R150SA-5 150±20% 500 600 1 1 5 6 5 300 2R230TA-5 2R230SA-5 230±20% 600 700 1 1 5 6 5 300 2R250TA-5 2R250SA-5 250±20% 600 700 1 1 5 6 5 300 2R300TA-5 2R300SA-5 300±20% 750 850 1 1 5 6 5 300 2R350TA-5 2R350SA-5 350±20% 800 900 1 1 5 6 5 300 2R420TA-5 2R420SA-5 420±20% 850 950 1 1 5 6 5 300 2R470TA-5 2R470SA-5 470±20% 900 1000 1 1 5 6 5 300 2R600TA-5 2R600SA-5 600±20% 1000 1200 1 1 5 6 5 300 2R800TA-5 2R800SA-5 800±20% 1300 1400 1 1 5 6 5 300 DIP -Nickel Plated SMD -Matte-tin plated 1) At delivery AQL 0.65 level II, DIN ISO 2859 2) In ionized mode 3) Insulation Resistance Measuring Voltage: 75V at DC 25V 90V~150V at DC 50V Other at DC 100V Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043. 2RA-5 Series Rev : www.leiditech.com 01.06.2015 2/5

Dimensions (Unit: mm/inch) DIP Series (2RxxxTA-5) SMD Series (2RxxxSA-5) Recommended Soldering Pad Layout Packaging Information (Unit: mm/inch) Axial Packaging (Bulk) Plastic Tray Inner box Packaging Quantity:

100 PCS per Plastic Tray

5 Plastic Trays per inner box

500 PCS per inner box

Rev : www.leiditech.com 01.06.2015 3/5

SMD Packaging (Tape & Reel) Tape Reel Inner box Packaging Quantity: 1,000 PCS per reel (13”) 3 reels per inner box 3,000 PCS per inner box Direction of Unreeling 2RA-5 Series Rev : www.leiditech.com 01.06.2015 4/5

Soldering Parameters - Wave soldering (Thru-Hole Devices) Wave Soldering Condition Pb-Free assembly Preheat Temperature Min 100°C Temperature Max 150°C Time (Min to Max) 60-180 Seconds Solder Pot Temperature 280°C Max Solder Dwell Time 2-5 Seconds Soldering Parameters - Reflow Soldering (Surface Mount Devices) Reflow Condition Pb - Free assembly Preheat -Temperature Min (Ts(min)) 150°C -Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 -180 Seconds Average ramp up rate ( Liquids Temp TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquids) 217°C - Time (min to max) (ts) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (tp) 10 - 30 Seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max Do not exceed 260°C 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 300 280 260 240 220 200 180 160 140 120 100 Temperature()℃-Measured bottom side of board Time(Seconds) Preheat Time Dwell Time Cooling Time Ramp-down Preheat Critical Zone TL to TP Time to peak temperature (t 25℃ to peak) TP TL TS(max) TS(min) Temperature Ramp-up Time 2RA-5 Series Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2015 5/5