2R075 LEIDITECH

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  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
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‡8OWUDVPDOOGHYLFHVRIIHUHGLQDYDULHW\\RI mounting lead forms ‡1RQ5DGLRDFWLYH ‡/RZFDSDFLWDQFH ‡9ROWDJH5DQJHV9WR9 ‡8/UHFRJQL]HG 66±4 8±0.3 6±0.3 6±0.3 8±0.3 -*: -*: 0.8±0.05 4±0.54±0.5 All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 01 ‡&RQIRUPVWR,787.,(&

(OHFWULDFO&KDUDFWHULVWLFV Type number DC Spark- over voltage Maimum Impulse spark- over voltage Impuise life Minimum Insulation resistance Maximum Capacitance Maximum surge Discharge Current Altermationg Dischare Curiren YV NYXV XV$ Test Voltage 0+] #XVWLPHV +]6 V V Times DC(V) pF .$ A % ±20% WLPHV '&9 .$ 10A % 90±20% '&9 >15 % ±20% % 230±20% DC 100V % 300±20% 900 % ±20% 1000 % ±20% 1000 % ±20% 1200 '&9 >15 % ±20% 1200 % ±20% 1300 ' ±20% ' ±20% '&9 .$ 20A ' 90±20% '&9 >15 ' ±20% ' 230±20% DC 100V ' 300±20% ' ±20% 1000 ' ±20% 1000 ' ±20% 1200 '&9 ' ±20% 1200 ' ±20% 1300 ' ±20% 1RWHV ,QVXODWLRQUHVLVWDQFHPHDVXUHDW '&9IRUWKH55 DQG5 DC 200V for other. 7HUPVLQDFFRUGDQFHZLWK,787.DQG*%7 $WGHOLYHU\\$4/OHYHO',1,62 All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 02

Pb – Free assembly Pre Heat -Temperature Min (T s(min) ) 150°C -Temperature Max (T s(max) ) 200°C -Time (Min to Max) (t s ) 60 – 180 secs Average ramp up rate (Liquidus Temp L ) to peak 3°C/second max T S(max) to T L - Ramp-up Rate 5°C/second max -Temperature (T L ) (Liquidus) 217°C -Temperature (t L ) 60 – 150 seconds Peak Temperature (T P ) 260 +0/-5 Time within 5°C of actual peak Temperature (t p ) 10 – 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260°C Time erutarep meT T P T L T S(max) T S(min) t P t L t S time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone T L to T P Soldering Parameters - W ave Soldering (Thru-Hole Devices) Soldering Parameters - Hand Soldering Dwell Time 100 120 140 160 180 200 220 240 260 280 300 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 Time (Seconds) Temperature (°C) - Measured on bottom side of board Cooling TimePreheat Time Wave Parameter Lead-Free Recommendation Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature Minimum: 100 C Temperature Maximum: 150 C Preheat Time: 60-180 seconds Solder Pot Temperature: 280 C Maximum Solder Dwell T ime: 2-5 seconds Recommended Process Parameters: Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 03

24 +0.3 / -0.1 11.5 ± 0.1 [0.453 ± 0.004] 1.75 ± 0.1 [0.059] 1.5 DIA. MAX. [0.059] 16 ± 0.1 [0.630 ± 0.004] 0.5 ± 0.05 [0.020 ± 0.002] 0.5 ± 0.01 [0.020 ± 0.004] 10x4 ± 0.1 = 40 ± 0.2 4 ± 0.1 [0.157 ± 0.004] 11.75 ± 0.1 [0.463 ± 0.004] 8 ± 0.1 [0.315 ± 0.004] 9 ± 0.1 [0.354 ± 0.004] 1.9 [0.075] Direction of Feed 25.7 [1.01] 275.0 [10.82] 100.0 [3.93] 25.0 [0.98] 76.0 [2.99] For 'LS' Type Shaped Lead Items 22.8 [0.898] 52.4 [2.063] 6.4 [0.252] <0.8 Max <1.2 Max. Lead Bend

5.0 Pitch

[0.197] 16 +0.3 / -0.1 7.5 ± 0.1 [0.295 ± 0.004] 8.5 ± 0.1 [0.335 ± 0.004] 1.75 ± 0.1 [0.059] 1.5 DIA. MAX. [0.059] 12 ± 0.1 [0.472 ± 0.004] 8.6 ± 0.1 [0.339 ± 0.004] 0.4 ± 0.05 [0.016 ± 0.002] 10x4 ± 0.1 = 40 ± 0.2 [10 x 0.157 ± 0.004 = 1. 575 ± 0.008] 4 ± 0.1 [0.157 ± 0.004] Direction of Feed 17.7 [0.697] 275.0 [10.83] 100.0 [3.94] 25.0 [0.98] 76.0 [2.99] For 'T' Type Axial Lead Items Core and 'MS' Type Items Direction of Feed 254.0 - 356.0 [10.0 - 14.0] 0.0 15] All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 04

2R3 0T % - Series DC Line Voltage Lead Type T=Thrust S=SMD Dimensions (OHFWULFDO Characteristics % $ D=20000A All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 05 Leiditech Electronics are trademarks. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Leiditech Electronics reserves the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes and replaces all information previously supplied. Without expressed or written consent by an officer of Leiditech Electronics, Leiditech Electronics does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. Leiditech Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. Leiditech Electronics’ only obligations are those in the Leiditech Electronics Standard Terms and Conditions of Sale and in no case will Leiditech Electronics be liable for any incidental, indirect, or consequential damages. SHANGHAI LEIDITECH ELECTRONICS CO.,LTD Tel: +86- 021 50828806 Fax: +86- 021 50477059-8008 Email: sale1@leiditech.com Website: http://www.leiditech.com Packaging Dimensions 单位mm 6.80mm 9.00mm 1.20mm 4.40mm 1.20mm 一圆一方结构尺寸 （Dimension of one round one square structure）： Quantity Per Reel:600pcs