2N3904E

2N3904E FS

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General Purpose Transistors NPN Silicon SOT-523 SEMICO NDUCTOR TECH NICAL DATA 2N3904E 2009. 11. 09 1/6Revision No : 0 MAXIMUM RATINGS Rating Symbol Va lue U nit Collector–Emitter Voltage V CEO 40 Vdc Collector–Base Voltage V CBO 60 Vdc Emitter–Base Voltage V EBO 6.0 Vdc Collector Current — Continuous I C 200 mAdc THERMAL CHARACTERISTICS FEATURE Simplifies Circuit Design.

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2N3904E MA 3000/Tape&Reel compliance with We declare that the material of product RoHS requirements. EMITTER COLLECTOR BASE a Ml o b m y Sc i t s i r e t c a r a h C x U nit Total Device Dissipation FR– 4 Board, (1) PD 200 mW TA = 25°C 6 . 1C ° 5 2 e v o b a e t a r e D mW/°C Thermal Resistance, Junction to Ambient RθJA 600 °C/W Pn o i t a p i s s i D e c i v e D l a t o TD 300 mW FR-4 Board(2), TA = 25°C 4 . 2C ° 5 2 e v o b a e t a r e D mW/°C Thermal Resistance, Junction to Ambient RθJA 400 °C/W Junction and Storage Temperature TJ , Tstg –55 to +150 °C DEVICE MARKING 2N3904E = MA ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted.) n i Ml o b m y Sc i t s i r e t c a r a h C Max U nit OFF CHARACTERISTICS Collector–Emitter Breakdown Voltage(3) V (BR)CEO 40 — Vdc (I C = 1.0 mAdc) Collector–Base Breakdown Voltage V (BR)CBO 60 — Vdc (I C = 10 µAdc) Emitter–Base Breakdown Voltage V (BR)EBO 6.0 — Vdc (I E = 10 µAdc) It n e r r u C f f o t u C e s a B BL — 50 nAdc ( V CE= 30 Vdc, V EB = 3.0 Vdc, ) It n e r r u C f f o t u C r o t c e l l o CCEX — 50 nAdc ( V CE = 30Vdc, V EB = 3.0Vdc ) 1. FR-4 Minimum Pad. 2. FR-4 1.0 x 1.0 Inch Pad. 3. Pulse Test: Pulse Width <300 µs, Duty Cycle <2.0%.

2009.101. 09 2/6Revision No : 0 2N3904E ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) (Continued) t i n U x a Mn i Ml o b m y S c i t s i r e t c a r a h C ON CHARACTERISTICS (3) h) 1 ( n i a G t n e r r u C C D FE –– (I C =0.1 mAdc, V CE – –0 4) c d V 0 . 1 = (I C = 1.0 mAdc, V CE – –0 7) c d V 0 . 1 = (I C = 10 mAdc, V CE 0 0 30 0 1) c d V 0 . 1 = (I C = 50mAdc, V CE – –0 6) c d V 0 . 1 = (I C = 100mAdc, V CE – –0 3) c d V 0 . 1 = Ve g a t l o V n o i t a r u t a S r e t t i m E – r o t c e l l o CCE(sat) Vdc (I C = 10 mAdc, I B 2 . 0– –) 3 ( ) c d A m 0 . 1 = (I C = 50 mAdc, I B 3 . 0– –) c d A m 0 . 5 = V) 3 ( e g a t l o V n o i t a r u t a S r e t t i m E – e s a BBE(sat) Vdc (I C = 10 mAdc, I B 5 8 . 05 6 . 0) c d A m 0 . 1 = (I C = 50mAdc, I B 5 9 . 0– –) c d A m 0 . 5 = SMALL–SIGNAL CHARACTERISTICS Current–Gain — Bandwidth Product f T 200 –- MHz(I C = 10mAdc, V CE= 20Vdc, f = 100MHz) Output Capacitance (V CB = 5.0Vdc, I E = 0, f = 1.0 MHz) C obo –– 4.0 pF Input Capacitance C ibo –– 8.0 pF(V BE = 0.5Vdc, I C = 0, f = 1.0 MHz) Input Impedancen h ie 1.0 10 pF(V CE = 10Vdc, I C = 1.0mAdc, f = 1.0 kHz) Voltage Feedback Ratio h re 0.5 8.0 X10 –4 (V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz) Small–Signal Current Gain h fe 100 400 —(V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz) Output Admittance h oe 1.0 40 θmhos(V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz) Noise Figure NF — 5.0 dB (V CE = 5.0 Vdc, I C = 100µAdc, R S = 1.0 k Ω, f = 1.0 kHz) SWITCHING CHARACTERISTICS Delay Time (V CC = 3.0 Vdc,V BE = 0.5Vdc t d — 35 nsRise Time I C = 10 mAdc, I B1 = 1.0mAdc) t r — 35 Storage Time (V CC t, c d V 0 . 3 = s — 200 Fall Time I C = 10 mAdc,I B1 = I B2 = 1.0mAdc) t f — 50 ns 3. Pulse Test: Pulse Width <300 µs, Duty Cycle <2.0%.

G M0.08 (0.003) X D 3 PL J -X- -Y- NOTES: 1. D MENSIONING AND TOLERANC NG PER ANSI Y14.5M, 1982. 2. CONTROLLING D MENSION: M LLIMETERS 3. MAXIMUM LEAD THICKNESS NCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C-01 OBSOLETE, NEW STANDARD 463C-02. A B Y 1 2 N 2 PL K C -T- SEATING PLANE DIM A MIN NOM MIN NOM INCHES 1.50 1.60 1.70 0.059 MILLIMETERS B 0.75 0.85 0.95 0.030 C 0.60 0.70 0.80 0.024 D 0.23 0.28 0.33 0.009 G 0.50 BSC H 0.53 REF J 0.10 0.15 0.20 0.004 K 0.30 0.40 0.50 0.012 L 1.10 REF S 1.50 1.60 1.70 0.059 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013

0.020 BSC

0.021 REF

0.006 0.008 0.016 0.020

0.043 REF

−−− 10 −−− 10 0.063 0.067 MAX MAX M HH L G RECOMMENDED PATTERN OF SOLDER PADS S SC-89 (SOT-523) 2009. 11. 09 6/6Revision No : 0 2N3904E