2MBI200VA-060-50 FUJI

Document overview

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Technical content

Features

Low Inductance module structure

Applications

AC and DC Servo Drive Amplifier Uninterruptible Power Supply Industrial machines, such as Welding machines Maximum Ratings and Characteristics Absolute Maximum Ratings (at T C=25°C unless otherwise specified) Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage VCES 600 V Gate-Emitter voltage VGES ±20 V Collector current IC Continuous TC=100°C 200 AIC pulse 1ms 400 -IC 200 -IC pulse 1ms 400 Collector power dissipation PC 1 device 650 W Junction temperature Tj 175 °COperating junction temperature (under switching conditions) Tjop 150 Case temperature TC 125 Storage temperature Tstg -40 ~ 125 Isolation voltage between terminal and copper base (*1) Viso AC : 1min. 2500 VAC Screw torque Mounting (*2) - 5.0 N mTerminals (*3) - 5.0 Note *1: All terminals should be connected together when isolation test will be done. Note *2: Recommendable Value : 3.0-5.0 Nm (M5 or M6) Note *3: Recommendable Value : 2.5-3.5 Nm (M5) Electrical characteristics (at T j= 25°C unless otherwise specified) Items Symbols Conditions Characteristics Unitsmin. typ. max. Zero gate voltage collector current ICES VGE = 0V, VCE = 600V - - 1.0 mA Gate-Emitter leakage current IGES VCE = 0V, VGE = ±20V - - 200 nA Gate-Emitter threshold voltage VGE (th) VCE = 20V, IC = 200mA 6.2 6.7 7.2 V Collector-Emitter saturation voltage VCE (sat) (terminal) VGE = 15V IC = 200A V Tj=125°C - 2.10 - Tj=150°C 2.30 VCE (sat) (chip) VGE = 15V IC = 200A Tj=125°C - 1.90 - Tj=150°C 2.10 Internal gate resistance RG (int) - - 4 - Ω Input capacitance Cies VCE = 10V, VGE = 0V, f = 1MHz - 12.8 - nF Turn-on time ton VCC = 300V LS = 30nH IC = 200A VGE = ±15V RG = 6.8Ω Tj = 150°C - 650 - nsec tr - 300 - tr (i) - 100 - Turn-off time toff - 600 - tf - 40 - Forward on voltage VF (terminal) VGE = 0V IF = 200A V Tj=125°C - 1.60 - Tj=150°C 1.57 VF (chip) VGE = 0V IF = 200A Tj=125°C - 1.50 - Tj=150°C 1.47 Reverse recovery time trr IF = 200A - 200 - nsec Thermal resistance characteristics Items Symbols Conditions Characteristics Unitsmin. typ. max. Thermal resistance (1device) Rth(j-c) IGBT - - 0.23 °C/WFWD - - 0.41 Contact thermal resistance (1device) (*4) Rth(c-f) with Thermal Compound - 0.050 - Note *4: This is the value which is defined mounting on the additional cooling fin with thermal compound.

IGBT Modules2MBI200VA-060-50 http://www.fujielectric.com/products/semiconductor/ Characteristics (Representative) 100 150 200 250 300 350 400 450 0 1 2 3 4 125°CT j=25°C 150°C 5 10 15 20 25 IC=400A IC=200A IC=100A 100 150 200 250 300 350 400 450 0 1 2 3 4 5 V GE=20V 15V 12V 10V 100 150 200 250 300 350 400 450 0 1 2 3 4 5 V GE= 20V 12V 15V 10V 0.1 100 0 10 20 30 Cies Coes Cres -20 -15 -10 -400 -300 -200 -100 100 200 300 400 VCE VGE Collector current vs. Collector-Emitter voltage (typ.) Tj= 150°C / chip Collector-Emitter voltage vs. Gate-Emitter voltage Tj= 25°C / chip Collector current vs. Collector-Emitter voltage (typ.) Tj= 25°C / chip Collector current vs. Collector-Emitter voltage (typ.) VCC=300V, IC=200A, Tj= 25°C Gate Capacitance vs. Collector-Emitter Voltage Dynamic Gate Charge (typ.) VGE= 0V, ƒ= 1MHz, Tj= 25°C VGE= 15V / chip Collector-Emitter Voltage: VCE [V] Collector Current: IC [A] Gate-Emitter Voltage: VGE [V] Collector-Emitter Voltage: VCE [V] Collector-Emitter voltage: VCE [V] Collector current: IC [A] Collector-Emitter voltage: VCE [V] Collector current: IC [A] Collector-Emitter voltage: VCE [V] Gate Capacitance: Cies, Coes, Cres [nF] Gate charge: Qg [μC] Gate-Emitter voltage: VGE [V] Collector-Emitter voltage: VCE [V]

http://www.fujielectric.com/products/semiconductor/ 100 1000 10000 0 100 200 300 400 500 100 1000 10000 1 10 100 100 200 300 400 500 0 100 200 300 400 500 600 700 800 100 120 140 1 10 100Tj=125oC Tj=150oC 0 100 200 300 400 500 Tj=125oC Tj=150oC 100 1000 10000 0 100 200 300 400 500 toff ton tr tf toff ton tr tf Eoff Err Eon toff ton tr tf Eoff Err Eon Reverse bias safe operating area (max.) Switching time vs. Collector current (typ.) VCC=300V, VGE=±15V, RG=6.8Ω, Tj=125°C Switching loss vs. Collector current (typ.)Switching time vs. Gate resistance (typ.) VCC=300V, IC=200A, VGE=±15V, Tj=125°C Switching time vs. Collector current (typ.) VCC=300V, VGE=±15V, RG=6.8Ω, Tj=150°C +VGE=15V, -VGE=15V, RG=6.8Ω, Tj=150°C VCC=300V, VGE=±15V, RG=6.8Ω, Tj=125, 150°C VCC=300V, IC=200A, VGE=±15V, Tj=125, 150°C Switching loss vs. Gate resistance (typ.) Collector current: IC [A] Switching time: ton, tr, toff, tf [nsec] Gate resistance: RG [Ω] Switching time: ton, tr, toff, tf [nsec] Collector-Emitter voltage: VCE [V] (Main terminals) Collector current: IC [A] Gate resistance: RG [Ω] Switching loss: Eon, Eoff, Err [mJ/pulse] Collector current: IC [A] Switching loss: Eon, Eoff, Err [mJ/pulse] Collector current: IC [A] Switching time: ton, tr, toff, tf [nsec]

IGBT Modules2MBI200VA-060-50 http://www.fujielectric.com/products/semiconductor/ 100 1000 0 100 200 300 400 500 0.001 0.01 0.1 0.001 0.01 0.1 1 FWD IGBT τ [sec] 0.0023 0.0301 0.0598 0.0708 Rth IGBT 0.02467 0.06255 0.08836 0.05442 [°C/W] FWD 0.04398 0.11150 0.15751 0.09701 100 150 200 250 300 350 400 450 0 1 2 3 125°C T j=25°C trr lrr trr lrr 150°C 100 1000 0 100 200 300 400 500 VCC=300V, VGE=±15V, RG=6.8Ω, Tj=150°C Transient Thermal Resistance (max.) Reverse Recovery Characteristics (typ.) VCC=300V, VGE=±15V, RG=6.8Ω, Tj=125°C Forward Current vs. Forward Voltage (typ.) chip Reverse Recovery Characteristics (typ.) Forward current: IF [A] Reverse recovery current: Irr [A] Reverse recovery time: trr [nsec] Pulse Width : Pw [sec] Thermal resistanse: Rth(j-c) [°C/W] Forward on voltage: VF [V] Forward current: IF [A] Forward current: IF [A] Reverse recovery current: Irr [A] Reverse recovery time: trr [nsec]

http://www.fujielectric.com/products/semiconductor/ C2E1 C2E1 Outline Drawings, mm Equivalent Circuit Schematic

IGBT Modules2MBI200VA-060-50 http://www.fujielectric.com/products/semiconductor/ WARNING 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of May 2011. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specifications. 2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design failsafe, flame retardant, and free of malfunction. 4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements.

  • Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment
  • Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty.
  • Transportation equipment (mounted on cars and ships) • Trunk communications equipment
  • Traffic-signal control equipment • Gas leakage detectors with an auto-shut-off feature
  • Emergency equipment for responding to disasters and anti-burglary devices • Safety devices
  • Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation).
  • Space equipment • Aeronautic equipment • Nuclear control equipment
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