27-21-T1D-CQ1R2NW-3C EVERLIGHT
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 12
Technical content
Features
․Package in 8mm tape on 7«diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version. Descriptions ․The 27-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide ChipPart No. Material Emitted Color Lens Color 27-21/T1D-CQ1R2NW/3C InGaN Pure White Yellow Diffused
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Package Outline Dimensions Note: The tolerances unless mentioned is Ô0.1mm,Unit = mm.
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Absolute Maximum Ratings (Ta=25Ċ) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 95 mW Electrostatic Discharge(HBM) ESD 150 V Operating Temperature Topr -40 ~ +85 Ċ Storage Temperature Tstg -40 ~ +90 Ċ Soldering Temperature Tsol Reflow Soldering : 260Ċ for 10sec. Hand Soldering : 350Ċ for 3 sec. Electro-Optical Characteristics (Ta=25Ċ) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 72 ----- 180 mcd Viewing Angle 2ǀ1/2 ----- 140 ----- deg Forward Voltage VF 2.70 ----- 3.70 V IF=15mA Reverse Current IR ----- ----- 50 DŽA VR=5V Notes: 1.Tolerance of Luminous Intensity Ô11% 2.Tolerance of Forward Voltage Ô0.1V
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Bin Range Of Luminous Intensity Bin Min Max Unit Condition Q1 72.0 90.0 Q2 90.0 112.0 R1 112.0 140.0 R2 140.0 180.0 mcd IF=15mA Bin Range Of Forward Voltage Symbol Bin Code Min. Max. Unit Condition 10 2.70 2.90 11 2.90 3.10 12 3.10 3.30 13 3.30 3.50 N 14 3.50 3.70 V IF=15mA Notes: 1.Tolerance of Luminous Intensity Ô11% 2.Tolerance of Forward Voltage Ô0.1V
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Chromaticity Coordinates Specifications for Bin Grading Groups Bin Code CIE_x CIE_y Condition 0.274 0.226 0.274 0.258 0.294 0.286 0.294 0.254 0.274 0.258 0.274 0.291 0.294 0.319 0.294 0.286 0.294 0.254 0.294 0.286 0.314 0.315 0.314 0.282 0.294 0.286 0.294 0.319 0.314 0.347 C 0.314 0.315 IF=15mA Notes: 2.The products are sensitive to static electricity and care must be fully taken when handling products.
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin CIE Chromaticity Diagram
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Typical Electro-Optical Characteristics Curves Relative Luminous Intensity vs. Ambient Temperature Spectrum Distribution Ambient Temperature T (°C)a Forward Current Derating Curve Relative Luminous Intensity (%) Forward Current I (mA) F Relative Luminous Intensity vs. Ta=25°CForward Current Relative Luminous Intensity (%) Relative Luminous Intensity (%)Forward Current I (mA)F Forward Voltage Forward Current vs. Radiation Diagram Ta=25°C Ambient Temperature T (°C)a Ta=25°C Forward Voltage V (V)F Forward Current I (mA) Ta=25°C -60 -20-40 0 20 6040 10080 100 1000
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Label explanation CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is Ô0.1mm, Unit = mm
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is Ô0.1mm, Unit = mm Moisture Resistant Packaging Label Desiccant LabelAluminum moisture-proof bag
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence levelj90% LTPDj10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260ĊÔ5Ċ Min. 5sec. 6 Min. 22 PCS. 0/1
2 Temperature Cycle
H : +100Ċ 15min í 5 min L : -40Ċ 15min 300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100Ċ 5min í 10 sec L : -10Ċ 5min 300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100Ċ 1000 Hrs. 22 PCS. 0/1
5 Low Temperature
Storage Temp. : -40Ċ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1
7 High Temperature /
High Humidity 85Ċ/ 85%RH 1000 Hrs. 22 PCS. 0/1
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 Ċ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30Ċ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking treatment : 60Ô5Ċ for 24 hours. 3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.
LifecyclePhase: Revision : 1 Expired Period: Forever Release Date:2009-05-06 09:17:36.0 27-21/T1D-CQ1R2NW/3C Device No. :DSE-0001360 Prepared date: 15-Apr-2009 Prepared by: Huang yongxin 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 Ċ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com