23-21C-T1D-CP2Q2TY-2A

23-21C-T1D-CP2Q2TY-2A_11 EVERLIGHT

Document overview

• Manufacturer or author: Provided By digicamel.com
• PDF pages: 12

Technical content

Features

․Package in 8mm tape on 7 〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version . Descriptions ․The 23-21C SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc.

Applications

․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. Chip Emitted Color Resin Color Material 23-21C/T1D-CP2Q2TY/2A InGaN Pure White Yellow Diffused

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Package Outline Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Absolute Maximum Ratings (Ta=25 ℃℃ ℃℃) Parameter Symbol Rating Unit Reverse Voltage V R 5 V Forward Current I F 25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 95 mW Electrostatic Discharge(HBM) ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25 ℃℃ ℃℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 57.0 ----- 112 mcd IF=5mA Viewing Angle 2θ1/2 ----- 140 ----- deg Forward Voltage VF 2.60 ----- 3.00 V Reverse Current I R ----- ----- 50 μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±± ±±11% 2.Tolerance of Forward Voltage ±± ±±0.05V

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Bin Range Of Luminous Intensity Bin Min. Max. Unit Condition P2 57.0 72.0 mcd I F=5mA Q1 72.0 90.0 Q2 90.0 112 Bin Range Of Forward Voltage Symbol Bin Min. Max. Unit Condition T 28 2.60 2.70 V IF=5mA 29 2.70 2.80 30 2.80 2.90 31 2.90 3.00 Notes: 1.Tolerance of Luminous Intensity ±± ±±11% 2.Tolerance of Forward Voltage ±± ±±0.05V

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Chromaticity Coordinates Specifications for Bin Grading Groups Bin Code CIE_x CIE_y Condition C 0.274 0.226 IF=5mA 0.274 0.258 0.294 0.286 0.294 0.254 0.274 0.258 0.274 0.291 0.294 0.319 0.294 0.286 0.294 0.254 0.294 0.286 0.314 0.315 0.314 0.282 0.294 0.286 0.294 0.319 0.314 0.347 0.314 0.315 Notes: 2.The products are sensitive to static electricity and care must be fully taken when handling products.

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A CIE Chromaticity Diagram

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Typical Electro-Optical Characteristics Curves Forward Current Derating Curve Forward Current I (mA) F 400 Relative luminous intensity ( )% 100 500 600 700 800 Ta=25° C Spectrum Distribution F Relative luminous intensity Forward Current 1 1 I (mA) Forward Current Luminous Intensity vs 100 )1000 (% Ta=25° C Forward Current Forward Voltage Ta=25° C Forward Current vs. Wavelength λ (nm) I (mA) F Forward Voltage (V )-volts F Relative luminous intensity (%) -60 -20 -40 0 20 60 40 100 80 100 1000 Luminous Intensity vs. Ambient Temperature Ambient Temperature Ta (° C) Ta=25° C Radiation Diagram Ambient Temperature Ta (° C) Duty=1/10 f=1KHz 0.8 0.7 1.0 0.9 90° 80° 50° 70° 60° 40° 10° 0° 20° 30° 40 20 60 100 85 2.8 0

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm RoHS Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX CAT : XXX HUE : XXX REF : XXX EVERLIGHT MADE IN TAIWAN

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Carrier Tape Dimensions : Loaded quantity 2000 pcs per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label Desiccant Label Aluminum moisture-proof bag

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level ：90% LTPD ：10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃± 5℃ Min. 5sec. 6 Min. 22 PCS. 0/1

2 Temperature Cycle

H : +100 ℃ 15min ∫ 5 min L : -40 ℃ 15min 300 Cycles 22 PCS. 0/1

3 Thermal Shock

H : +100 ℃ 5min ∫ 10 sec L : -10 ℃ 5min 300 Cycles 22 PCS. 0/1

4 High Temperature

Storage Temp. : 100 ℃ 1000 Hrs. 22 PCS. 0/1

5 Low Temperature

Storage Temp. : -40 ℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS. 0/1

7 High Temperature /

High Humidity 85 ℃/ 85%RH 1000 Hrs. 22 PCS. 0/1

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30 ℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30 ℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions. Baking treatment : 60 ±5℃ for 24 hours. 3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.

Device No.: Pre pared date:3-Jul-2011 Prepared by: Sam Feng 23-21C/T1D-CP2Q2TY/2A 4. Soldering Iron Each terminal is to go to the tip of soldering iro n temperature less than 350 ℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs hav e been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, F ax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http:// www.everlight.com