217 ETC

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
  • PDF pages: 21

Technical content

wakefield-vette.com A wide variety of heat dissipators with various attachment mechanisms for surface mount and thru-hole power semiconductors packaged in industry standard plastic, ceramic, and metal cases such as D2Pak, TO-220, TO-3 to TO-247, DO-4 to DO-11, multiwatt, hex-type, and stud mount devices. Board Level Heat Sinks for TO-220, TO-218 Universal 678 Series Vertical Heat Sink for BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 46–76 48–49 59–61 79–80 81–83

wakefield-vette.com Contact us: (603) 635-2800 SURFACE MOUNT HEAT SINK SURFACE MOUNT HEAT SINKS Footprint Height Above Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection Material: Copper, Matte Tin Plated Tube: 16.25 Inches Long, Min. esd Material with Nail Stops

20 Pieces per Tube

REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS TUBE DETAILS BOARD LAYOUT RECOMMENDATIONS TAPE DETAILS

217 SERIES

KEY:  Device only, NC  Device + HS, NC  Device + HS, 100 lfm  Device + HS, 200 lfm  Device + HS, 300 lfm MECHANICAL DIMENSIONS Device Power Dissipation. W Device Tab dT, C THERMAL PERFORMANCE

6 LAYER BOARD, D’ PAK

125°C LEAD, 40°C AMBIENT Dimensions: in. Dimensions: in. NOTES 1. Material to be “ESD” 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS

218 SERIES

Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Copper, Matte Tin Plated 218-40CT3 218-40CT5 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4 Solid line = 218-40CT5 Dashed Line = 218-40CT3 NATURAL AND FORCED CONVECTION CHARACTERISTICS Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers’ component thermal specifications. SURFACE MOUNT HEAT SINKS Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D2PAK; TO-220; SOT-223; SOL-20 SMT Devices D2PAK; TO-220; SOL-20

  • No interface material is needed
  • Copper with matte tin plating for improved solderability and assembly
  • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
  • EIA standards and ESD protection are specified
  • Can be used with water soluble or no clean SMT solder creams or other pastes FEATURES AND BENEFITS

wakefield-vette.com Contact us: (603) 635-2800 TAPE DETAILS BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS REEL DETAILS Height Off Base Power Dissipation @ Thermal Resistance Package Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type 219-263A TO-263 SMD Solderable 0.500" 1.020" 0.480" 2W @ 30°C 8°C/W @ 500 LFM Bulk HEAT SINK Feet (12.70mm) (25.91mm) (12.19mm) ANODZD MECHANICAL DIMENSIONS TAPE AND REEL INFORMATION Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.

  • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish.
  • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets.
  • Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time.
  • Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks.
  • Available in bulk packaging or Tape & Reel. FEATURES AND BENEFITS 219-263A HEAT SINK FOR TO-263 DEVICES

219 SERIES HEAT SINKS FOR TO-263 DEVICES

Height Off Base Power Dissipation @ Thermal Resistance Package Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type 219-263A-TR TO-263 SMD Solderable 0.500" 1.020" 0.480" 2W @ 30°C 8°C/W @ 500 LFM Tape & Reel HEAT SINK Feet (12.70mm) (25.91mm) (12.19mm) ANODZD Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.

  • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish.
  • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets.
  • Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time.
  • Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks.
  • Available in bulk packaging or Tape & Reel. FEATURES AND BENEFITS TAPE AND REEL INFORMATION THERMAL RESISTANCE MECHANICAL DIMENSIONS 219-263A-TRHEAT SINK FOR TO-263 DEVICES THERMAL RESISTANCE

wakefield-vette.com Contact us: (603) 635-2800 BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS VERTICAL MOUNT HEAT SINK Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C ) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS

230 SERIES

234 SERIES

230-75AB-05230-75AB-10230-75AB-01 234-75AB 234-75AB-01 234-75AB-05

230 AND 234 SERIES

Dimensions: in. (mm) COMPACT, WAVE-SOLDERABLE LOW-PROFILE SELF-LOCKING HEAT SINKS 230 & 234 SERIES

262 SERIES HORIZONTAL AND VERTICAL MOUNT HEAT SINK

Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4

206 SERIES

Thermal Performance at Typical Load Height Above Footprint Solderable Standard PC Board Dimensions Mounting Tab Mounting Natural Forced P/N in. (mm) in. (mm) Configuation Option Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS HORIZONTAL MOUNT HEAT SINK MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4 Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Aluminum, Black Anodized

241 SERIES

Thermal Performance at Typical Load TO-220 TO-220 TO-220 TO-220

wakefield-vette.com Contact us: (603) 635-2800 PATENT PENDING 233-60AB 236-150AB BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS 233 & 236 SERIES Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Dimensions: in. (mm) NATURAL AND FORCED CONVECTION CHARACTERISTICS 233-60AB-05 236-150AB-05 233-60AB-01 236-150AB-01 233-60AB-10 236-150AB-10 COMPACT, STRESS-FREE LABOR-SAVING LOCKING-TAB HEAT SINKS COMPACT, STRESS-FREE LABOR-SAVING LOCKING-TAB HEAT SINKS 275 & 231 SERIES 275 & 231 SERIES PATENT 5381041 Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) PATENT

5381041 Height Above Footprint

Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Dimensions: in. (mm) Dimensions: in. (mm) MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS SELF-LOCKING WAVE-SOLDERABLE HEAT SINKS MECHANICAL DIMENSIONS

235 SERIES

COMPACT, STRESS-FREE LABOR-SAVING LOCKING-TAB HEAT SINKS All versions No Tab TAB 14V TAB 13V TAB 13H TAB 13H TAB 01 TAB 10 TAB 15V NATURAL AND FORCED CONVECTION CHARACTERISTICS 235-85AB-10235-85AB-01 235-85AB 235-85AB-05 Thermal Performance at Typical Load Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-220 TO-220 TO-220 TO-220 NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS

wakefield-vette.com Contact us: (603) 635-2800 MECHANICAL DIMENSIONS 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4 NATURAL AND FORCED CONVECTION CHARACTERISTICS BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 10 0 02 00 40 06 00 80 01 00 0 AI R V ELO CITY ( LF M) HE AT S IN K TE MPER ATURE R ISE ABOV E AMBI EN T AI R (C ) 02 00 40 06 00 80 01 00 0 H EAT DI SSI PATED (W ATTS ) TH ERMAL RESI ST A NCE SIN K TO AM BI ENT (C ) 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) H EAT SIN K TEMPE RATU RE R ISE ABOVE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTAN CE SIN K TO AMBI ENT (C ) 10 0 02 00 400 60 08 00 1000 AI R VE LOCI TY ( LFM) HE AT SIN K TEMP ER AT UR E RI SE AB OV E AM BI ENT AIR (C ) 02 00 400 60 08 00 1000 HEAT DISSIPATE D (W AT TS) TH ERMA L RE SISTAN CE SIN K TO AMBI ENT (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCI TY ( LFM) HEAT SINK TEMPER ATUR E RISE AB OVE AMBIEN T AI R (C ) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) THER MA L RESISTAN CE S INK TO AMBIEN T (C ) 1 5 4 3 2 10 0 02 00 40 06 00 80 01 00 0 AI R VE LOCITY (LF M) HE AT SIN K TEMPE RA TU RE R ISE ABOVE AMBIENT AIR (C ) 02 00 40 06 00 80 01 00 0 H EAT D ISSIPATED (W ATTS ) TH ERMA L R ESISTAN CE SIN K TO AMBIENT ( C ) 2 10 8 6 4 10 0 02 00 40 06 00 80 01 00 0 AIR VEL OCIT Y (L FM) H EAT SIN K TEMP ER AT UR E RI SE ABO VE AMB IENT AIR (C) 02 00 40 06 00 80 01 00 0 HEAT DISSIPATE D (W AT TS) TH ERMAL R ESISTA NC E SI NK T O AMBI ENT (C ) 2 10 8 6 4 Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) Natural Convection Forced Convection Material: Aluminum, Black Anodized PATENT PENDING Dimensions: in. (mm) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SECTION A-A 239-75AB 239-75AB-03 239-75AB-04

265 SERIES

239 SERIES

SNAP-DOWN SELF-LOCKING HEAT SINKS LABOR-SAVING CLIP-ON HEAT SINKS Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Pre-anodized Black

243 SERIES

286DB SERIES VERTICAL MOUNT HEAT SINK NATURAL AND FORCED CONVECTION CHARACTERISTICS VIEW B-BSECTION A-A Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Dimensions: in. (mm) MECHANICAL DIMENSIONS TO-220 TO-220 TO-220 TO-220

wakefield-vette.com Contact us: (603) 635-2800 BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS

242 SERIES LOW-COST, LOW-HEIGHT WAVE-SOLDERABLE HEAT SINKS

CONVECTION CHARACTERISTICS 242-125AB-22 LABOR-SAVING TWISTED FIN HEAT SINKS MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 240-118ABH-22 Dimensions: in. (mm) Dimensions: in. (mm) 240-118ABS-22 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 274-XAB-01 274-XAB-02 Dimensions: in. (mm)

274 SERIES

281 SERIES

LOW-COST, LOW-HEIGHT WAVE-SOLDERABLE HEAT SINKS Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 273-AB 273-AB-01 273-AB-02

273 SERIES

LOW-COST, LOW-HEIGHT WAVE-SOLDERABLE HEAT SINKS 274 & 281 SERIES

240 SERIES

Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Dimensions: in. (mm) TO-220 TO-220 TO-220 TO-220 and TO-218

wakefield-vette.com Contact us: (603) 635-2800 Dimensions: in. (mm) Dimensions: in. (mm) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 232-200AB-23 238-200AB 238-200AB-23 232-200AB 238 SERIES 232 AND 238 SERIES BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS 232 & 238 SERIES STAGGERED FIN HEAT SINKS FOR VERTICAL MOUNTING Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 251-62AB 251-80AB 251-80AB-19

251 SERIESSLIM-PROFILE HEAT SINKS WITH INTEGRAL CLIPS

Standard PC Board Dimensions Mounting Solderable Natural Force Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Material: Aluminum, Black Anodized

244 SERIES

LOW HEIGHT, SLIM PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS Dimensions: in. (mm) Height Above Footprint Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Material: Aluminum, Black Anodized

245 SERIES

LOW HEIGHT, SLIM PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS Dimensions: in. (mm) Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized Thermal Performance at Typical Load Thermal Performance at Typical Load Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 & MULTIWATT™ COMPONENTS Multiwatt

15 Lead Multiwatt

246 SERIES

249 SERIES

MEDIUM HEIGHT, SLIM PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS MEDIUM HEIGHT, DEEP PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS Dimensions: in. (mm) MECHANICAL DIMENSIONS

247 SERIES

MEDIUM HEIGHT, DEEP PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS Dimensions: in. (mm) MECHANICAL DIMENSIONS

248 SERIES

Order SpeedClips™ separately for use with Series 246, 247, 248 or 249 LOW HEIGHT, MEDIUM PROFILE WAVE-SOLDERABLE FOLDED FIN HEAT SINKS Dimensions: in. (mm) MECHANICAL DIMENSIONS Height Above Footprint Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Order SpeedClip™ 285SC or 330SC separately. Material: Aluminum, Black Anodized Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Thermal Performance at Typical Load BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 & MULTIWATT™ COMPONENTS Dimensions: in. (mm) MECHANICAL DIMENSIONS Multiwatt Multiwatt Multiwatt Multiwatt

288 SERIES

COMPACT WAVE-SOLDERABLE LOW-COST HEAT SINKS Height Above Maximum Standard PC Board Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Dimensions: in. (mm)MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. NATURAL AND FORCED CONVECTION CHARACTERISTICS

271 SERIES

TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH 270/272/280 SERIES TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH 270/272/280 SERIES SMALL FOOTPRINT LOW-COST HEAT SINKS Height Above Horizontal Mounting Standard PC Board Maximum Footing Solderable Natural Forced Weight P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED CONVECTION CHARACTERISTICS

270 SERIES 280 SERIES

272 SERIES 272AB01 272AB02

Dimensions: in. (mm) MECHANICAL DIMENSIONS 270, 272, &

280 SERIES

Thermal Performance at Typical Load Horizontal Height Above Mounting Footprint Standard Semiconductor Case Dimensions Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 31 °C @ 4W (NOTE B) 1.8°C/W 400 LFM (NOTE B) Material: Aluminum, Black Anodized Thermal Performance at Typical Load Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-220 TO-220 TO-220 and TO-202 TO-220 and TO-202

Contact us: (603) 635-2800 Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles. One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS 289 & 290 SERIES LOW-COST SINGLE OR DUAL PACKAGE HEAT SINKS Height Above Horizontal Mounting Standard PC Board Maximum Footing Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) Material: Aluminum, Black Anodized Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS289 SERIES 290 SERIES Dimensions: in. (mm) Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 250-122AB 250-122AB-09 250-122AB-25250 SERIES

250 SERIES

HIGH-PERFORMANCE SLIM PROFILE HEAT SINKS WITH INTEGRAL CLIPS Thermal Performance at Typical Load Thermal Performance at Typical Load Height Above Footprint Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS227-167 237-167AB3 252-167AB3 237-167AB3 252-167 237-167AB2 252-167AB2 237-167AB2-24 252-167AB2-24

237 AND 252 SERIES

HIGH-PERFORMANCE, HIGH-POWER VERTICAL MOUNT HEAT SINKS 237 & 252 SERIES Thermal Performance at Typical Load Vertical Height Above Mounting Footprint Standard PC Board Dimensions Mounting Natural Forced Weight P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams) Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS

291 SERIES

Dimensions: in. (mm) Dimensions: in. (mm) MECHANICAL DIMENSIONS LABOR-SAVING CLIP-ON HEAT SINKS Thermal Performance at Typical Load TO-218; TO-202; TO-220 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Dimensions: in. (mm) MECHANICAL DIMENSIONS TO-220 TO-220 Multiwatt

wakefield-vette.com Contact us: (603) 635-2800 Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave-soldered directly to the board. See also 286DB Series on page 55. BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS NATURAL AND FORCED CONVECTION CHARACTERISTICS Height Above Standard PC Board Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams) Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).

286 SERIES

ALUMINUM AND COPPER LOW-COST WAVE-SOLDERABLE HEAT SINKS Thermal Performance at Typical Load MECHANICAL DIMENSIONS Dimensions: in. (mm)

287 SERIES

PC Board Footprint “A” Natural Forced Weight Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams) Material: Aluminum, Black Anodized Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-220 and similar semiconductor packages. NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N Dim. “A” 287-1AB 0.500 (12.7) 287-2AB 1.000 (25.4) 287-1ABH 0.500 (12.7) 287-2ABH 1.000 (25.4) WAVE-SOLDERABLE LOW-COST HEAT SINKS MECHANICAL DIMENSIONS Dimensions: in. (mm) Standard P/N Thermal Performance at Typical Load Standard Nominal Installed For Use Weight P/N Loading Force With Series Material lbs. (grams) 285 SC 10 lbs 232, 237, 240, 252, 667 Carbon Steel 0.00053 (0.24) 330 SC 4 lbs 232, 237, 240, 252, 667 Stainless Steel 0.00074 (0.34) SpeedClips™ employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClips™ with our 237, 240, and 252 Series heat sinks for the lowest production assembly time and cost. Order one SpeedClip™ for each heat sink purchased. Must be purchased with heat sinks. Speed Clip 330 SC 4 lb (17.8N) Nominal Force Installed Speed Clip 285 SC 10 lb (44.5N) Nominal Force Installed 285 & 330 SERIES285 SC AND 330 SC SPEEDCLIPS™ MECHANICAL DIMENSIONS Dimensions: in. (mm)

695 SERIES

Standard Width Height Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each design provides good heat dissipation for use where height is limited above the printed circuit board or base plate. SPACE-SAVING HEAT SINKS FOR SMALL STUD-MOUNTED DIODES Thermal Performance at Typical Load NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-220 TO-220 Stud-Mount

260 SERIES

260 SERIESEPOXY INSULATED FOR TO-5

Base Mounting Configurations — TO-5 Plain Type — Epoxy bonded, or used with #4 pan head screws. Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Thread Size: 4 = #4-40 UNC Base Style: H = hex 6 = #6-32 UNC Semiconductor Mounting T = tapped Case Style: 5 = TO-5 Style: S = stud Insulation E = epoxy P = plain Characteristics TO-5 Thermal Resistance – Epoxy Insulated 14° C/W Breakdown Voltage – Epoxy Type (VAC), 60 Hz 500 Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating 50 Dusty Conditions: % Hipot Rating 30 Dirty Conditions: % Hipot Rating 10 to 20 Temperature Range — Continuous (C°) -73/+149 Depth of Model Tapped Base 260-4T5E 0.093 (2.36) 260-4TH5E 0.125 (3.18) Outline Dimension Standard Insulation L x W x I.D. Weight Case P/N Type in. (mm) lbs. (grams) Style Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C” CUP CLIPS FOR TO-5 CASE STYLE SEMICONDUCTORS TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE 260-4T5E 260-4TH5E 260-6SH5E

258 SERIESTHERMAL LINKS FOR FUSED GLASS DIODES

Standard Dimensions Weight P/N in. (mm) Material Finish lbs. (grams) except solder pads and base The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt. MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS Dimensions: in. (mm)

634 SERIES

PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams) Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave-solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. TYPICAL THERMAL PERFORMANCE FOR 634-15ABP SLIM PROFILE UNIDIRECTIONAL FIN VERTICAL MOUNT HEAT SINK Dimensions: in. (mm) Standard P/N BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-5 Diodes TO-220 and TO-218 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. NOTES:

wakefield-vette.com Contact us: (603) 635-2800 04 81 21 62 0 0 200 400 600 800 1000 100 AIR VELOCITY (FPM) POWER DISSIPATION (WATTS) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT (ϒC) THERMAL RESISTANCE SINK TO AMBIENT (ϒC/WATT) 667-10ABP 667-10ABP 667-25ABP667-25ABP Speed Clip 330SC 4 lb Nominal Force Installed Speed Clip 285SC 10 lb Nominal Force Installed 0.093 (2.4) DIA 0.156 (4.0) 0.670 (17.0) 0.730 (18.5) 0.062 (1.6) REF 1.375 (34.9)REF 0.500 (12.7)REF 1.000 (25.4) 0.180 (4.6) DIA 0.093 (2.4) (NOMINAL) DIA 0.044 (1.1) (STANDOFF) 0.130 (3.3) 0.125 (3.2) DIA RAISED BOSS x 0.030 (0.8) HIGH A Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices.

626 AND 627 SERIES

Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) Material: Aluminum, Black Anodized BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS

667 SERIES

637 SERIES

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS Dimensions: in. (mm) Dimensions: in. (mm) HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL BOARD MOUNTING 626 & 627 SERIES HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL BOARD MOUNTING Thermal Performance at Typical Load (EXTRUSION PROFILE 8073) STANDOFF PINS “SP” PLAIN PINS “PP” Height Above Maximum Standard P/N PC Board “A” Footprint Natural Forced Weight Standoff Pin Plain Pin in. (mm) in. (mm) Convection Convection lbs. (grams) Order 330 SC or 285 SC SpeedClip™ separately. Wave-solderable pins. Material: Aluminum, Black Anodized Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost. LABOR-SAVING SPEEDCLIP™ HEAT SINKS FOR VERTICAL BOARD MOUNTING Dimensions: in. (mm) POWER DISSIPATION (WATTS) AIR VELOCITY (FPM) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT (°C) 0.156 (4.0) 0.093 (2.4) 0.130 (3.3) DIA THERMAL RESISTANCE SINK TO AMBIENT (°C/WATT) MECHANICAL DIMENSIONS Thermal Performance at Typical Load 0.044 (1.1) (STANDOFF) Height Above Maximum Standard Standard PC Board “A” Footprint Natural Forced P/N P/N in. (mm) in. (mm) Convection Convection Wave-solderable pins. Material: Aluminum, Black Anodized Thermal Performance at Typical Load

292 SERIES

CONVECTION CHARACTERISTICS Height Above Overall Standard PC Board Fin Width Thermal Performance Weight P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams) Material: Aluminum, Black Anodized HEAT SINK FOR SINGLE TO-92 MECHANICAL DIMENSIONS Dimensions: in. (mm) BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Speed Clip 330SC Speed Clip 285SC 10 lb Nominal Force Installed 4lb Nominal Force Installed1.000 (25.4) 0.180 (4.6) 0.093 (2.4) NOMINAL) DIA DIA 0.125 (3.2) DIA RAISED BOSS x 0.030 (0.8) HIGH 0.670 (17.0) 048121 620 0 200 400 600 800 1000 100 AIR VELOCITY (FPM) POWER DISSIPATION (WATTS) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT (ϒC) THERMAL RESISTANCE SINK TO AMBIENT (ϒC/WATT) 667-10ABP 667-10ABP 667-25ABP 667-25ABP Speed Clip 330SC 4 lb Nominal Force Installed Speed Clip 285SC 10 lb Nominal Force Installed 0.093 (2.4)DIA 0.156 (4.0) 0.670 (17.0) 0.730 (18.5) 0.062 (1.6)REF 1.375 (34.9)REF 0.500 (12.7)REF 1.000 (25.4) 0.180 (4.6)DIA 0.093 (2.4) (NOMINAL) DIA 0.044 (1.1) (STANDOFF) 0.130 (3.3) 0.125 (3.2) DIA RAISED BOSS x 0.030 (0.8) HIGH A 0.500 (12.7) 1.375 (34.9) 0.062 (1.6) 0.730 (18.5) REF REF REF TO-92 TO-220 TO-220 TO-220 and TO-218 NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS

647 SERIES 657 SERIES

HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL BOARD MOUNTING

657 SERIES

HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL BOARD MOUNTING HIGH-PERFORMANCE NOTCHED HEAT SINKS FOR VERTICAL BOARD MOUNTING NATURAL AND FORCED CONVECTION CHARACTERISTICS

647 SERIES

(EXTRUSION PROFILE 5195) Height Above Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory Products section for thermal interface materials, 126 Series silicone-free thermal compounds, and other accessories products. MECHANICAL DIMENSIONS Dimensions: in. (mm) Thermal Performance at Typical Load NATURAL AND FORCED CONVECTION CHARACTERISTICS Height Above Maximum Standard PC Board “A” Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs (grams) Wave-solderable pins. Material: Aluminum, Black Anodized Thermal Performance at Typical Load NATURAL AND FORCED CONVECTION CHARACTERISTICS (EXTRUSION PROFILE 6533) Height Above Maximum Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection Wave-solderable pins. Material: Aluminum, Black Anodized Thermal Performance at Typical Load MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS Dimensions: in. (mm) Dimensions: in. (mm) HIGH-PERFORMANCE HEAT SINKS WITH SPEEDCLIPS™ FOR VERTICAL BOARD MOUNTING NATURAL AND FORCED CONVECTION CHARACTERISTICS (EXTRUSION PROFILE 6533) Height Above Maximum Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection Wave-solderable pins. Material: Aluminum, Black Anodized Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS MECHANICAL DIMENSIONS Dimensions: in. (mm) TO-220 TO-218; TO-247; TO-220 TO-218; TO-247; TO-220 TO-218; TO-247; TO-220 (EXTRUSION PROFILE 6533)

Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS

677 SERIES 680 SERIES

HIGH-PERFORMANCE, HIGH-POWER HEAT SINKS FOR VERTICAL BOARD MOUNTING

690 SERIES

MAXIMUM EFFICIENCY OMNIDIRECTIONAL HEAT SINKS NATURAL AND FORCED CONVECTION CHARACTERISTICS

677 SERIES

(EXTRUSION PROFILE 8719) Height Above Maximum Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS Dimensions: in. (mm) Dimensions: in. (mm) Dimensions: in. (mm) Thermal Performance at Typical Load Height Above Semiconductor Standard PC Board Outline Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C. NATURAL AND FORCED CONVECTION CHARACTERISTICSSEMICONDUCTOR MOUNTING HOLES TO-3 TO-66 *TWO TO-220’S Thermal Performance at Typical Load Height Above Horizontal Mounting Semiconductor Standard PC Board “A” Footprint Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES TO-3 A 220 K *TWO TO-220’S Thermal Performance at Typical Load 601 & 603 SERIES HIGHEST EFFICIENCY/LOWEST UNIT COST HEAT SINKS LOW-HEIGHT HEAT SINKS Footprint Mounting Standard Dimensions Height Hole Dia. Natural Forced Weight P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams) Material: Aluminum Alloy, Black Anodized Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-3; TO-220 TO-218; TO-220; TO-247; 15-Lead Multiwatt TO-3; TO-66; TO-220 DO-4/DO-5 Diodes

641 SERIES

MAXIMUM PERFORMANCE NATURAL CONVECTION HEAT SINK FOR ALL METAL-CASE SEMICONDUCTORS 601 & 603 SERIES LOW-HEIGHT HEAT SINKS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES

601 SERIES

(EXTRUSION PROFILE 1284)

603 SERIES

(EXTRUSION PROFILE 1284) K E F Dimensions: in. (mm) Dimensions: in. (mm) (EXTRUSION PROFILE 1371) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Outline Mounting Standard Dimensions Height Hole Natural Forced Weight P/N in. (mm) in. (mm) Pattern Convection Convection lbs. (grams) Material: Aluminum Alloy, Black Anodized. Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS Thermal Performance at Typical Load BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS DO-4/DO-5 Diodes TO-3 Thermal Resistance Part Number Description Length Width @ Forced Air Flow 678-39-S Universal Heat Sink for TO Devices w/Screw Hole, 1.520" 2.362" 0.6°C/W @ 600 LFM Black Anodize (38.61mm) (60.00mm) 678-39-C Universal Heat Sink for TO Devices w/ Clip, 1.520" 2.362" 0.6°C/W @ 600 LFM Black Anodize (38.61mm) (60.00mm) UNIVERSAL 678 SERIES VERTICAL HEAT SINK FOR POWER DEVICES Wakefield-Vette introduces Universal 678 series, high performance, low cost and versatile heat sink with screw or clip for all kinds of standard packages. This type of heat sink provides both vertical and horizontal mounting options on PCB to accommodate natural and forced convection cooling method.

  • Minimum assembly cost and labor - Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs.
  • Design Flexibility - Universal mountable and “one fits all” give designers total freedom to fit their packaging designs with ideal device pack style and to orient the heat sink to meet their power dissipations with optimized cooling method. (see page 7 of data sheet). FEATURES AND BENEFITS
  • Heat Sink: Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish
  • Spring Clip: Music Wire, Per ASTM A228 with bright nickel plating
  • Solder Foot: Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant.
  • Insulator (Optional): t-Global H48-1, L37-3F and H48-6S. The thickness of the insulating material not to exceed 10 mil (0.01”). SPECIFICATIONS MECHANICAL DIMENSIONS THERMAL PERFORMANCE

wakefield-vette.com Contact us: (603) 635-2800 BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS CPC1998J PACKAGE ONE HEAT SINK FOR ALL PACKAGES System level – 2 screws Natural convection – Vertical CPC40055ST PACKAGE Board level – 2 solder pins Natural convection – Vertical Spring Clip Board level – 2 solder pins Natural convection – Vertical Spring Clip CPC1968 AND TO-264 PACKAGE Board level – 2 solder pins Natural convection – Vertical Spring Clip L4970A PACKAGE Board level – 2 solder pins Natural convection – Vertical Screw attachment KBU PACKAGE Board level – 2 solder pins Natural convection – Vertical Spring Clip TO-247 AND TO-220 PACKAGE Board level – 2 solder pins Natural convection – Vertical Screw attachment or Spring Clip MOUNTAIN SERIES HEAT SINKS FOR TO-264, TO-247 DEVICES Wakefield-Vette's Mountain Series Heat Sinks are high performance, low cost, configurable, scalable and compact with a matrix clip system for TO220, TO-247, TO-264 and other standard packages. This type powerful heat sink provides easiest assembly, largest surface areas, smallest space occupation and all-in- one solution. The power dissipations can be easily increased simply by extending the fin height on each side of the heat sink, while keeping the heat sink height and PCB layout the same. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling. Part Package Attachment Height Off Base Thermal Resistance Material Number Description Type Cooled Method Length Width (Height of Fin) @ Forced Air Flow Material Finish MTN-264-27 Heat Sink w/ Two Top Mount TO-247 and Clip and PC Pin 1.06" 1.740" 1.56" 5.5°C/W @ 18 Watts Aluminum Black Clips for TO-247 TO-264 (27mm) (44.3mm) (39.5mm) Anodized TO-264 THERMAL RESISTANCEMECHANICAL DIMENSIONS

  • Minimum assembly cost and labor - Spring Clips make the mounting holes and fasteners obsolete in assembly operations and reduce costs.
  • Maximum Thermal Transfer - Maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance. FEATURES AND BENEFITS
  • Maximum Repeatability - Constant spring force over repeated assembly/disassembly.
  • Maximum Reliability - Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping. MTN-264-27 SOT-227 PACKAGE

wakefield-vette.com Contact us: (603) 635-2800 Wakefield-Vette's Mountain Series Heat Sinks are high performance, low cost, configurable, scalable and compact with a matrix clip system for TO220, TO-247, TO-264 and other standard packages. This type powerful heat sink provides easiest assembly, largest surface areas, smallest space occupation and all-in-one solution. The power dissipations can be easily increased simply by extending the fin height on each side of the heat sink, while keeping the heat sink height and PCB layout the same. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling. Part Package Attachment Height Off Base Thermal Resistance Material Number Description Type Cooled Method Length Width (Height of Fin) @ Forced Air Flow Material Finish MTN-264-55 Heat Sink w/ Two Top Mount TO-247 and Clip and PC Pin 2.17" 1.740" 1.56" 3.7°C/W @ 18 Watts Aluminum Black Clips for TO-247 TO-264 (55.11mm) (44.3mm) (39.5mm) Anodized TO-264

  • Minimum assembly cost and labor - Spring Clips make the mounting holes and fasteners obsolete in assembly operations and reduce costs.
  • Maximum Thermal Transfer - Maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance. FEATURES AND BENEFITS
  • Maximum Repeatability - Constant spring force over repeated assembly/disassembly.
  • Maximum Reliability - Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping. THERMAL RESISTANCEMECHANICAL DIMENSIONS BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS MOUNTAIN SERIES HEAT SINKS FOR TO-264, TO-247 DEVICES omniKLIP™ SERIES HEAT SINK W/ CLIP(s) FOR TO-DEVICES The Wakefield- Vette omniKlip Heat Sink Series are a configurable and patented (Pat. Pending) high performance, low cost and compact solutions for TO-220, TO-247 and TO-264 , or similar packages. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling.
  • Minimum assembly cost and labor - Spring Clips make the mounting holes, fasteners, tools and fixtures obsolete in assembly operations & reduce costs.
  • Maximum Repeatability - Constant spring force over repeated assembly/disassembly
  • Maximum Reliability - Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping
  • Design Flexibility - Maximum flexibility for dynamic device locations and power up grading. “Configure-to-Fit” gives designers total freedom to configure heat sink needed to fit their dynamic design environments. FEATURES AND BENEFITS
  • Heat Sink: Aluminum Alloy 6063-T5 or Equivalent with black anodized finish.
  • Spring Clip: Music Wire, Per ASTM A228 with bright nickel plating
  • Solder Foot: Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant. SPECIFICATIONS WkV Part Related Package Height Off Base Number Description Clip Cooled Length Width (Height of Fin) OMNI-UNI-18-25 OmniKlip Heat Sink, OMNI-UC TO-247, TO-264 0.984" 1.500" 0.710" 18mm wide, 25mm long, (25.00mm) (38.10mm) (18.03mm) black anodized for TO-247 & TO-264 OMNI-UNI-18-50 OmniKlip Heat Sink , OMNI-UC TO-247, TO-264 1.969" 1.500" 0.710" 18mm wide, 50mm long, (50.00mm) (38.10mm) (18.03mm) black anodized for TO-247 & TO-264 OMNI-UNI-18-75 OmniKlip Heat Sink, OMNI-UC TO-247, TO-264 2.95" 1.500" 0.710" 18mm wide, 75mm long, (75.00mm) (38.10mm) (18.03mm) black anodized for TO-247 &TO 264 OMNI-220-18-25-1C OmniKlip Heat Sink w/1 clip, TO-220 0.984" 1.500" 0.710" 18mm wide, 25mm long, (25.00mm) (38.10mm) (18.03mm) black anodized for TO-220 OMNI-220-18-50-2C OmniKlip Heat Sink w/2 clips, TO-220 1.969" 1.500" 0.710" 18mm wide, 50mm long, (50.00mm) (38.10mm) (18.03mm) black anodized for TO-220 OMNI-220-18-75-3C OmniKlip Heat Sink w/3 clips, TO-220 2.95" 1.500" 0.710" 18mm wide, 75mm long, (75.00mm) (38.10mm) (18.03mm) black anodized for TO-220 THERMAL PERFORMANCE (OMNI-UNI-18)MECHANICAL DIMENSIONS TWO TO-247 DEVICES WITH SIL-PAD 900s L = 500mm[2.0"] MTN-264-55 OMNI-CLIP-18-L SERIES HEAT SINKS

wakefield-vette.com Contact us: (603) 635-2800 BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS WkV Part Package Height Off Base Number Description Related Cross Sell Part Cooled Shape Length Width (Height of Fin) OMNI-UNI-32-58 OmniKlip Heat Sink OMNI-UC, OMNI-220C TO-247, TO-264 Rectangular, 2.28" 1.25" 1.62" for 2 universal 2 clips, Fins (58mm) (32mm) (46.3mm) 32mm wide, 58mm long, black anodized for any TO except TO-220 MECHANICAL DIMENSIONS THERMAL PERFORMANCE WkV Part Package Height Off Base Number Description Related Cross Sell Part Cooled Shape Length Width (Height of Fin) OMNI-UNI-41-75 OmniKlip Heat Sink OMNI-UC, OMNI-220C TO-247, TO-264 Rectangular, 2.95" 1.61" 1.62" for 2 universal 2 clips, Fins (75mm) (41mm) (46.3mm) 41mm wide, 75mm long, black anodized for any TO except TO-220 MECHANICAL DIMENSIONS Part Number Description OMNI-UC Universal Clip for omniKlip Heat Sink for any TO except T0220 OMNI-220C Clip for omniKlip Heat Sink for TO 220 Universal Clip mechanism is rotating the bar by 180°. The eccentric circle will raise 0.09”. This deformation will exert the force on the components. omniKlip assembly model in ANSYS, with 18 lbf load applied to the clip Under the 18 lbf, the clip deformed 0.09” from its original position to the final Directional deformation plot as shown. With the FEA analysis and simulation, the force applied to the TO-series components will be at least 18 lbs. OmniKLIP™ SERIES HEAT SINK W/ CLIP(s) FOR TO-DEVICES OMNIKLIPS™OMNI-UNI-32-L SERIES HEAT SINKS OMNI-UNI-41-L SERIES HEAT SINKS THERMAL PERFORMANCE

wakefield-vette.com BOARD LEVEL HEAT SINKS ADDITIONAL CONFIGURATIONS OMNI-UNI-41-L SERIES FACE TO FACE MOUNTING (SPACE SAVER) OMNI-UNI-32-L SERIES BACK TO BACK MOUNTING WITH 40MM FAN OMNI-UNI-32-L SERIES FACE TO FACE MOUNTING (SPACE SAVER) OMNI-UNI-41-L SERIES BACK TO BACK MOUNTING WITH 60MM FAN