08-350000-10-HT ARIES
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 1
Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout
- Available on 0.300 [7 .62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers GENERAL SPECIFICATIONS
- BOARD MATERIAL : 0.062 ]1.58] thick Polyimide, Tg 260°C with 1-oz. Cu traces, both sides
- PADS: finished with white Sn
- PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- PIN PLATING: 200μ [5.08μ] Sn/Pb 93/7 per ASTM B579-73 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290
- OPERATING TEMPERATURE: 200°C max. MOUNTING CONSIDERATIONS 18005 Rev. AA Series 350000-10-HT High-Temperature SOIC-to-DIP Adapter
ORDERING INFORMATION
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED “A” = NO. OF PINS PER ROW x 0.100 [2.54] “D” = (NO. OF PINS PER ROW -1) x 0.100 [2.54] AVAILABLE IN PANELIZED FORM WITH OR WITHOUT CUSTOMER- SUPPLIED DEVICES MOUNTED. CONSULT FACTORY CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS