1T405A SONY
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 4
Technical content
Features
- Super-small-miniature flat package
- Low series resistance 0.85 Ω Max. (f=470 MHz)
- Large capacitance ratio 12.5 Typ. (C 2/C25) 1.03 Min. (C 25/C28)
- Small leakage current 10 nA Max. (VR =28 V)
- Capacitance deviation within 2 %
Applications
Electronic tuning of VHF band and wide-band CATV tuners Structure Silicon epitaxial planar type diode Electrical Characteristics (Ta=25 °C) Unit nA V pF pF Ω Max. 38.96 2.96 0.85 Typ. 12.5 Min. 32.96 2.53 12.0 1.03 Item Reverse current Reverse voltage Diode capacitance Capacitance ratio Series resistance Capacitance deviation in a matching group Symbol I R VR C 2 C 25 C 2/C25 C 25/C28 rs Conditions VR =28 V IR =1 µA VR =2 V, f=1 MHz VR =25 V, f=1 MHz C D =14 pF, f=470 MHz VR =2 to 25 V, f=1 MHz The continuous 20 pieces of ∆C are guaranteed.
—2— 1T405A 12 5 1 0 2 0 5 0 100 Diode capacitance vs. Reverse voltage VR -Reverse voltage (V) C-Diode capacitance (pF) Reverse current vs. Ambient temperature –20 0 20 40 60 80 Ta-Ambient temperature (°C) IR-Reverse current (pA) 100 1000 100 Reverse current vs. Reverse voltage IR-Reverse current (pA) 10.00 10000.00 1000.00 100.00 1 10 100 VR -Reverse voltage (V) 1.00 Ta=25°C, f=1MHz VR =28V /LiteDiagLines/LiteDiagLines/LiteDiagLines Ta=60°C /LiteDiagLines/LiteDiagLines/LiteDiagLines Ta=25°C /LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines Ta=80°C
—3— 1T405A 1000 Thermal coefficient of diode capacitance 11 0 VR -Reverse voltage (V) Thermal coefficient (ppm/°C) 100 100 0.99 1.00 1.01 1.02 1.03 1.04 Diode capacitance vs. Ambient temperature C (Ta) / C (25°C)-Diode capacitance VR =1V VR =2V VR =25V VR =15V VR =7V Forward voltage vs. Ambient temperature V F-Forward voltage (V) –20 0 20 40 60 80 Ta-Ambient temperature (°C) 0.80 0.70 0.60 0.50 Reverse voltage vs. Ambient temperature V R-Reverse voltage (V) –20 0 20 40 60 80 Ta-Ambient temperature (°C) IF=1mA IR =10µA –20 0 20 40 60 80 Ta-Ambient temperature (°C) 0.97 0.98 f=1MHz f=1MHz
Package Outline Unit : mm 1T405A —4— SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER b 1.7 ± 0.1 10° MAX c 0.8 ± 0.1 10° MAX 0.7 ± 0.1 c b 0.11 ± 0.005 0.3 ± 0.025 BASE METAL 0.11 – 0.01 0.3 – 0.02 WITH PLATING + 0.05 + 0.05 M-290 0.2 ± 0.05 0.002g M-290 1.3 ± 0.1 M A 0.2 A S51 2 1 : Cathode 2 : Anode MARK