1SS222

1SS222 NEC

Document overview

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Technical content

a, 1S$222,1SS223 HIGH SPEED SWITCHING SILICON EPITAXIAL DIODES MINI MOLD

FEATURES

PACKAGE DIMENSIONS . in enillimetars © Low capacitance: C,=4.0 pF MAX. © High speed switching: t,,=3.0 ns MAX. al 2.840.2 © Wide applications including switching, limiter, clipper. 2 15 0.652315 s Ho ABSOLUTE MAXIMUM RATINGS i | in Maximum Voltages and Currents (T4= 25 °C) a} & gs} Ss eee ee a 188222 188223 it a go T 3 Peak Reverse Voltage Vam 70 100 Vv 3 : Fi ry g DC Reverse Voltage Va 70 100 v Peak Forward Current lem 300 300 mA Average Rectified Current Io 100 100 mA o Marking DC Forward Current Ie 100 100 mA hd 3 Maximum Temperatures

3 Fl Junction Temperature Tj 150 °c

be} S Storage Temperature Range Tseg —55 to +150 °c - Thermal Resistance Connection Diagram S . 7 2, (Top View) ral Junction to Ambient Reha 0.67 C/mw Cathode

3 Marking : A7

NC. ELECTRICAL CHARACTERISTICS (Tg=25 °C) Forward Voltage Veo | 850 | 1000 mV Ip =50 mA | nny SEE EPP ee Veg | 950 1200 mV Ip = 100 mA feverse Current — Capacitance Cy { { 2.0 40 pF Vr=0, f=1.0 MHz . Ip=10 mA, VR=6 V, Reverse Recovery Time ter 3.0 | ns F a= 100 a Sov Test Circuit. ‘The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. D16319EJ3VODS00 (3rd edition) (Previous No. DC-1057A) Date Published July 2002 N CP(K) . Printed in Japan © NEC Corporation 1985

NEC 1$S222,1SS223 TYPICAL CHARACTERISTICS (T, = 25 °c) FORWARD CURRENT vs. REVERSE CURRENT vs. FORWARD VOLTAGE REVERSE VOLTAGE 1000 10 a a | ee oH 500. 5.0 = oof | | | ToT 2of | ee rol | | | Of 7 x i ces ee iL 20 ia 02 a 7 Ay 2 oes Ee | SSeS S20 8 oop} | ft oof td | 5 ot —_| 7 f fl | S oosbee L 02 tA fit = oooep__1_| | TT | an AL At [tt = oof | | | | TT [| a | A CO 0.05 0.0005, cor} Ff If Foi | | coooe} | | | f | 7 TI ot _/ YT ooo _| [| TT ) 02 04 0.6 o8 10 12 Oo 10 20 30 40 50 60 70 Vp—Forward Voltage—V Vp—Reverse Voltage—V ° FORWARD VOLTAGE TEMPERATURE TERMINAL CAPACITANCE vs. — COEFFICIENT vs FORWARD CURRENT REVERSE VOLTAGE = 30 30 a f=10 MHz & Ta=25 C SPAT pe TT Ps oS 8 COI —S

3 PPX 1 2 | ~~

% © 2 10 Bae 5 10 s £ PLL ET z ETE TT) PP = 0 t) .) 0.1 02 05 10 20 6.010 20 60 100 1 2 4 6 810 20 «30 lp—Forward Current~mA Vp—Reverse Voltage-V

2 Data Sheet D16319EJ3VODS

NEC 1$S222,1SS223 SWITCHING CHARACTERISTICS TEST CIRCUIT Reverse recovery time : ty, Circuit Capacitance C<1 pF prnyrnnnn nnn tte lp=10 mA 5p Gh LO u . (Rg=50 9 "OQ, Sampling w% | IF ‘rr |ies0 6 ns pulse i oscilloscope | t |tp=100 ns Generator L-- Ri=50 Q 1 \\Duty Cycles %. t, $0.35 ns 9 % "| Ve i ige=O.1 I V=VR+VE input signal output signal Test circuit Wave forms 1p =10 mA, Va =6.0 V Data Sheet D16319EJ3VODS 3

NEC 1$$222,1SS223 © The information in this document is current as of July, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: “Standard", "Special" and "Specific". The "Specific quality grade applies only to semiconductor products developed based on a customer-designated “quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). MBE 00.4