1S2837

1S2837 NEC

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Technical content

a, 1S$2837,1S2838 HIGH SPEED SWITCHING SILICON EPITAXIAL DOUBLE DIODES : COMMON CATHODE MINI MOLD

FEATURES

| ____in millimeters | @ Low capacitance: C; = 1.1 pF TYP. | a 1S 0.65315 | © Wide applications including switching, limitter, clipper. | £ — | © Double diode configuration assures economical use. | cH | | «| & ime s| 3 a ABSOLUTE MAXIMUM RATINGS a) = ER a) 8 a 3 Maximum Voltages and Currents (Ta = 25 °C) | tt | =) 182837 182838 | t Peak Reverse Voltage Vam 35 75 Vv DC Reverse Voltage Vr 30 50 v Marking * | | Surge Current (1 us) lesm 6.0 6.0 A < 3 | Surge Current (1 ys) lesm. 4.0 4.0 A | 7 + s | Peak Forward Current* lem 450 450 mA | 3 Sh Peak Forward Current lem 300 300 mA | ~ | Average Rectified Current* | 150 150 mA | Connection Diagram F | . (Top View) $ | Average Rectified Current Io 100 100 mA | Maximum Temperatures 2 | Anode | Junction Temperature Tj 125 125 °c

3 Storage Temperature Range Tsig =55to +125 -58t0+125 °C

1 Thermal Resistance

Anode Juncti Ambient® ° Marking junction to Ambient Ren {j-a) 1.0 1.0 ‘C/mW teeeae aS Junction to Ambient Renij-a) 0.67 0.67 °C/mw 7 * Both diodes loaded simultaneously ELECTRICAL CHARACTERISTICS (Tg = 25 °C) CHARACTERISTIC | SYMBOL een UNIT TEST CONDITIONS MIN max. | min. | TYP. | MAX. | Vey | 0.67 1.0 0.67 10 5 Vv Ip =10mA Forward Voltage | Veg 07 | 44 0.75 Ti |v | Ip=50mA im | J or | | HA | VR=30V i IR | 0.1 BA | VR=50V Capacitance [oy 110 | 4.0 14 | 4.0 pF | VR =0,f= 1.0 MHz Reverse Recovery Time tir | 3.0 ns | See Test Circuit. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. 016321EJ3V0DS00 (3rd edition) (Previous No. DC-1055A) Date Published July 2002 N CP(K) . Printed in Japan © NEC Corporation 1985

NEC 1S$2837,1S2838 TYPICAL CHARACTERISTICS (T, = 25 °c) FORWARD CURRENT vs. REVERSE CURRENT vs. a FORWARD VOLTAGE 182837 REVERSE VOLTAGE 182837 100 eS eS 100

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oy a Oe ot || | Trt ett tT ist Tt ett ttt tli |

2 SS = a

; ERE SESE SS SS ee ps a A 2 ° pati r rp Pi ae LEE TTT TTT Te A A | A A SA SS ol ee on ty) 10 20 30 40 50 0 02 04 06 08 1.0 12 Vp—Reverse Voltage—V Ve—Forward Voltage—V FORWARD CURRENT vs. REVERSE CURRENT vs.

00 FORWARD VOLTAGE 182838 100 REVERSE VOLTAGE 182838

¢oLLET LEAT TT eee /| I i 0 % 10 BREE i) St a 2 co g a PCocceeeee RRR N 1 ———| = bhatt ts wet itt sa eS = =——— = FERRER REE === ==- =a | _ SCOPE, EEE 0.1 oO 10 20 30 40 50 Oo 02 o4 06 08 10 12 Vp—Reverse Voltage—V Vp—Forward Voltage-V TERMINAL CAPACITANCE vs. REVERSE RECOVERY TIME vs. REVERSE VOLTAGE 1$2837, 182838 ° FORWARD CURRENT 1$2837, 182838 ° “CLUTTTTT TT

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b 9s EE é g © TRE FL ee o2 HTT - ett | ell TTT TTT PPC os 1 2 5 10 20 50 100 i) 20 40 60 80 100 Vp—Reverse Voltage—V Ip—Forward Current—mA

2 Data Sheet D16321EJ3VODS

NEC 182837,1S2838 REVERSE RECOVERY TIME (t,,) TEST CIRCUIT Input Voltage Output Current Triger Wavetorm to Diode Waveform in Diode + a + Pulse Pree Sampling owe o—E enerator a_i | Oscilloscope (50 9) (50 Q) VR | [ott +3ko Ir ol | = ip=10 mA, Vg=6.0 V, R[=100 2 | ip =O.1+ly | pot Data Sheet D16321EJ3V0DS 3

NEC 1S2837,1S2838 * The information in this document is current as of July, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The “Specific" quality grade applies only to semiconductor products developed based on a customer-designated “quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). MBE 00.4