1PMT5913BT3 MOTOROLA

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MOTOROLA1PMT5913BT3 through 1PMT5948BT3 /C0080/C0114/C0111/C0100/C0117/C0099/C0116 /C0080/C0114/C0101/C0118/C0105/C0101/C0119 /C0050/C0046/C0053 /C0087/C0097/C0116/C0116 /C0080/C0108/C0097/C0115/C0116/C0105/C0099 /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0090/C0101/C0110/C0101/C0114 /C0068/C0105/C0111/C0100/C0101/C0115 /C0080/C0111/C0119/C0101/C0114/C0109/C0105/C0116/C0101 /C0080/C0097/C0099/C0107/C0097/C0103/C0101 This complete new line of zener/tvs diodes offers a 2.5 watt series in a micro miniature, space saving surface m ount package. The Powermite zener/tvs diodes are designed for use as a tvs or a regulation device in automotive and telecommunication applications where efficiency, low leakage, size/height and profile are important. Features:

  • Voltage Range – 3.3 to 91 V
  • ESD Rating of Class 3 (> 16 kV) per Human Body Model
  • Low Profile – maximum height of 1.1mm
  • Integral Heat Sink/Locking Tabs
  • Full metallic bottom eliminates flux entrapment
  • Small Footprint – Footprint area of 8.45mm2
  • Supplied in 12mm tape and reel – 12,000 units per reel
  • Powermite is JEDEC Registered as DO–216AA MAXIMUM RATINGS Rating Symbol Value Unit DC Power Dissipation @ TL = 75°C, Measured at Zero Lead Length Derate above 75°C °PD ° 2.5 °Watts° mW/ °C DC Power Dissipation @ TA = 25°C(1) Derate above 25°C °PD ° 380 2.8 °mW mW/ °C Thermal Resistance from Junction to Lead R θJL 26 °C/W Thermal Resistance from Junction to Ambient R θJA 324 °C/W Operating and Storage Junction T emperature Range TJ, Tstg – 65 to +150 °C Typical Ppk Dissipation @ TL < 25°C, (PW–10/1000 µs per Figure 8)(2) Ppk 200 Watts Typical Ppk Dissipation @ TL < 25°C, (PW–8/20 µs per Figure 9)(2) Ppk 1000 Watts (1)FR4 Board, within 1” to device, using Motorola minimum recommended footprint, as shown in case 403A outline dimensions spec. (2)Non–repetitive current pulse. This document contains preview information only and is subject to change without notice. Powermite is a registered trademark of Microsemi Corporation. Thermal Clad is a trademark of the Bergquist Company. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA Order this document by 1PMT5913BT3/D  Motorola, Inc. 1996 /C0049/C0080/C0077/C0084/C0053/C0057/C0049/C0051/C0066/C0084/C0051 /C0116/C0104/C0114/C0111/C0117/C0103/C0104 /C0049/C0080/C0077/C0084/C0053/C0057/C0052/C0056/C0066/C0084/C0051 PLASTIC SURFACE MOUNT ZENER DIODES

2.5 WATTS

3.3–91 VOLTS CASE 457–01 PLASTIC 1 2 1: CATHODE 2: ANODE

1PMT5913BT3 through 1PMT5948BT3 ELECTRICAL CHARACTERISTICS (VF = 1.5 Volts Max @ IF = 200 mAdc for all types.) Device* Nominal Zener Voltage VZ @ IZT Volts (Note 1) Test Current IZT mA Max Zener Impedance (Note 2) Max Reverse Leakage Current Maximum DC Zener Current IZM mAdc Device MarkingDevice* VZ @ IZT Volts (Note 1) Current IZT mA ZZT @ IZT Ohms ZZK Ohms IZK mA@ IR µA VR Volts Current IZM mAdc Device Marking 1PMT5913BT3 3.3 113.6 10 500 1 100 1 454 913B 1PMT5914BT3 3.6 104.2 9 500 1 75 1 416 914B 1PMT5915BT3 3.9 96.1 7.5 500 1 25 1 384 915B 1PMT5916BT3 4.3 87.2 6 500 1 5 1 348 916B 1PMT5917BT3 4.7 79.8 5 500 1 5 1.5 319 917B 1PMT5918BT3 5.1 73.5 4 350 1 5 2 294 918B 1PMT5919BT3 5.6 66.9 2 250 1 5 3 267 919B 1PMT5920BT3 6.2 60.5 2 200 1 5 4 241 920B 1PMT5921BT3 6.8 55.1 2.5 200 1 5 5.2 220 921B 1PMT5922BT3 7.5 50 3 400 0.5 5 6.8 200 922B 1PMT5924BT3 9.1 41.2 4 500 0.5 5 7 164 924B 1PMT5925BT3 10 37.5 4.5 500 0.25 5 8 150 925B 1PMT5926BT3 11 34.1 5.5 550 0.25 1 8.4 136 926B 1PMT5927BT3 12 31.2 6.5 550 0.25 1 9.1 125 927B 1PMT5928BT3 13 28.8 7 550 0.25 1 9.9 115 928B 1PMT5929BT3 15 25 9 600 0.25 1 11.4 100 929B 1PMT5930BT3 16 23.4 10 600 0.25 1 12.2 93 930B 1PMT5931BT3 18 20.8 12 650 0.25 1 13.7 83 931B 1PMT5932BT3 20 18.7 14 650 0.25 1 15.2 75 932B 1PMT5933BT3 22 17 17.5 650 0.25 1 16.7 68 933B 1PMT5934BT3 24 15.6 19 700 0.25 1 18.2 62 934B 1PMT5935BT3 27 13.9 23 700 0.25 1 20.6 55 935B 1PMT5936BT3 30 12.5 26 750 0.25 1 22.8 50 936B 1PMT5937BT3 33 11.4 33 800 0.25 1 25.1 45 937B 1PMT5938BT3 36 10.4 38 850 0.25 1 27.4 41 938B 1PMT5939BT3 39 9.6 45 900 0.25 1 29.7 38 939B 1PMT5940BT3 43 8.7 53 950 0.25 1 32.7 34 940B 1PMT5941BT3 47 8 67 1000 0.25 1 35.8 31 941B 1PMT5942BT3 51 7.3 70 1100 0.25 1 38.8 29 942B 1PMT5943BT3 56 6.7 86 1300 0.25 1 42.6 26 943B 1PMT5944BT3 62 6 100 1500 0.25 1 47.1 24 944B 1PMT5945BT3 68 5.5 120 1700 0.25 1 51.7 22 945B 1PMT5946BT3 75 5 140 2000 0.25 1 56 20 946B 1PMT5947BT3 82 4.6 160 2500 0.25 1 62.2 18 947B 1PMT5948BT3 91 4.1 200 3000 0.25 1 69.2 16 948B * TOLERANCE AND VOLTAGE DESIGNATION Tolerance designation — The type numbers listed indicate a tolerance of ±5%. Devices listed in bold, italic are Motorola preferred devices.

MOTOROLA1PMT5913BT3 through 1PMT5948BT3 INFORMATION FOR USING THE POWERMITE SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. POWERMITE 0.100 2.54 0.025 0.635 0.050 1.27 0.105 2.67 0.030 0.762 inches mm POWERMITE POWER DISSIPATION The power dissipation of the Powermite is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data shee t for the Powermite package, PD can be calculated as follows: PD = TJ(max) – TA R θJA The values for the equation are found in the m aximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 386 milliwatts. PD = 150°C – 25°C 324°C/W = 386 milliwatts The 324°C/W for the Powermite package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 386 milliwatts. There are other alternatives to achieving higher power dissipation from the Powermite package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.
  • The soldering temperature and time shall not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

1PMT5913BT3 through 1PMT5948BT3 OUTLINE DIMENSIONS CASE 457–01 ISSUE O DIM MIN MAX MIN MAX INCHESMILLIMETERS A 1.75 2.15 0.069 0.081 B 1.75 2.15 0.069 0.086 C 0.85 1.15 0.033 0.045 D 0.40 0.65 0.016 0.026 F 0.70 1.00 0.028 0.039 J 0.10 0.25 0.004 0.010 K 3.60 4.15 0.142 0.163 L 0.50 0.80 0.020 0.031 R 1.20 1.50 0.047 0.059 S 0.50 REF 0.020 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. SBM0.08 (0.003) C ST –A– –B– S J K –T– H L J C D SBM0.08 (0.003) C ST F TERM. 1 CATHODE TERM. 2 ANODE R Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 T atsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 1PMT5913BT3/D /C0042/C0049/C0080/C0077/C0084/C0053/C0057/C0049/C0051/C0066/C0084/C0051/C0047/C0068/C0042