1PMT5.0AT1G-T3G LITTELFUSE

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 5

Technical content

Features

The 1PMT5.0AT1G/T3G Series is designed to protect voltage sensitive components from high voltage, high energy transients. Excellent clamping capability, high surge capability, low Zener impedance and fast response time. The advanced packaging technique provides for a highly efficient micro miniature, space saving surface mount with its unique heatsink design. It has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles (1 .1 mm) in the industry. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines, power supplies and many other industrial/consumer applications.

Description

Maximum Ppk Dissipation, (PW−10/1000 µs) (Note 1) (1PMT5.0A − 1PMT36A) PPK 200 W Maximum Ppk Dissipation, (PW−10/1000 µs) (Note 1) (1PMT40A − 1PMT58A) P PK 175 W Maximum Ppk Dissipation, (PW−8/20 µs) (Note 1) P PK 1000 W DC Power Dissipation @ TA = 25°C (Note 2) Derate above 25°C Thermal Resistance, Junction−to− Ambient TJ, Tstg 500 4.0 248 mW mW/ºC Thermal Resistance, Junction− to−Lead (Anode) R8Janode 35 °C/W Maximum DC Power Dissipation (Note 3) Thermal Resistance, Junction−to−Tab (Cathode) P D R8Jcathode 3.2 W °C/W Operating and Storage Temperature Range TJ, Tstg −55 to +150 °C Maximum Ratings and Thermal Characteristics 1PMT5.0AT1G/T3G Series Functional Diagram Bi-directional Uni-directional Cathode Anode Pb Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1 . Nonrepetitive current pulse at TA = 25 °C. 2. Mounted with recommended minimum pad size, DC board FR−4. 3. At Tab (Cathode) temperature, Ttab = 75°C Additional Information Samples Resources Datasheet

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/14/17 TVS Diodes Surface Mount > 200W > 1PMT5.0AT1G/T3G Series Electrical Characteristics (TL = 30C unless otherwise noted, VF = 1.25 Volts @ 200 mA) Device* Device Marking V RWM VBR @ IT (V) (Note 6) IT IR @ VRWM VC @ IPP IPP (A) (Note 5) MIN NOM MAX (mA) (µA) (V) (Note 7) 4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. 5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. VBR measured at pulse test current IT at ambient temperature of 25°C. 7 . Surge current waveform per Figure 2 and derate per Figure 4. *The “G’’ suffix indicates Pb−Free package.

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/14/17 TVS Diodes Surface Mount > 200W > 1PMT5.0AT1G/T3G Series Dimensions Part Marking System NOTES: 1 . DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS Physical Specifications Case Void-free, transfer-molded, thermosetting plastic Leads Modified L−Bend providing more contact area to bond pads Finish All external surfaces are corrosion resistant and leads are readily solderable Mounting Position Any

ORDERING INFORMATION

Device Package Shipping† 1PMTxxAT1G POWERMITE (Pb−Free 3,000 / Tape & Reel 1PMTxxAT3G POWERMITE (Pb−Free) 12,000 / Tape & Reel Flow/Wave Soldering (Solder Dipping) Peak T emperature : 260OC Dipping Time : 10 seconds Dim Inches Millimeters Min Max Min Max A 0.069 0.081 1 .75 2.05 B 0.069 0.086 1 .75 2.18 C 0.033 0.045 0.85 1. 15 D 0.016 0.027 0.40 0.69 F 0.028 0.039 0.70 1. 0 0 J 0.004 0.010 0.10 0.25 K 0.142 0.154 3.60 3.90 L 0.020 0.031 0.50 0.80 R 0.047 0.059 1 .20 1 .50 S 0.50 REF 0.50 REF Soldering Footrpint MARKING DIAGRAM CATHODE ANODE M= Date Code Mxx= Specific Device Code (See Table on Page 3) =P b Free Package Mxx M SBM0.08 (0.003)C ST A B S J K T H L J C D SBM0.08 (0.003)C ST F PIN 1 PIN 2 R 2.54 0.100 0.635 0.025 1.27 0.050 2.67 0.105 0.762 0.030 mm inchesSCALE 10:1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.