1P620_10 ANAREN

Document overview

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Technical content

Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 1P620 Rev C Pico Xinger 20dB Directional Coupler

Description

The 1P620 Pico Xinger is a low profile , miniature 20dB directional coupler in an easy to use surface mount package designed for MMDS and WLAN applications. The 1P620 is for power and frequency detection as well as power injection. The 1P620 is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates such as FR4, G- 10, RF-35, RO4003 and polyimide. Available in both 5 of 6 tin lead (1P620) and 6 of 6 RoHS compliant tin immersion (1P620S). ELECTRICAL SPECIFICATIONS** Frequency Mean Coupling Insertion Loss VSWR Freq. Sensitivity GHz dB dB Max Max : 1 dB Max Directivity Power Handling ΘJC Operating Temp. dB Min Watts ºC / Watt ºC Features:

  • 2.3 – 2.7 GHz
  • MMDS and WLAN
  • Very Low Loss
  • High Directivity
  • Surface Mountable
  • Tape And Reel
  • Available in Lead-Free (as illustrated) or Tin-Lead 20 25 35 -55 to +85 **Specification based on performance of unit proper ly installed on microstrip printed circuit boards with 50 Ω nominal impedance. Specifications subject to change without notice. Mechanical Outline 1P620* Rev A Mechanical Outline Dimensions are in Inches [Millimeters] .250±.010 [6.35±0.25] .200±.010 [5.08±0.25] .064±.013 [1.64±0.33] Pin 4 Pin 1 Pin 2 Pin 3 Pin 1 Pin 4 Pin 3 Pin 2 4X .020±.004 [0.51±0.10] GND 4X .034±.004 SQ [0.86±0.10] Orientation Marker Denotes Pin Location .170±.004 [4.32±0.10] .120±.004 [3.05±0.10] Denotes Array Number GND

USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. Hybrid Coupler Pin Configuration The 1P603S has an orientation marker to denote Pin 1. Once port one has been identified the other ports are known automatically. Please see the chart below for clarification: 20dB Coupler Pin Configuration Pin 1 Pin 2 Pin 3 Pin 4 Input Direct Isolated Coupled Direct Input Coupled Isolated Note: The direct port has a DC connection to the input port and the coupled port has a DC connection to the isolated port. For optimum IL and power handling performance, use Pin 1 or Pin 2 as inputs.

Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 1P620 Rev C Insertion Loss and Power Derating Curves Typical Insertion Loss Derating Curve for 1P620S -0.3 -0.25 -0.2 -0.15 -0.1 -0.05 -100 -50 0 50 100 150 200 25 0 Temperature of the Part (oC) Insertion Loss (dB) typical insertion loss (f=2700Mhz) 1P620 Power Derating Curve 0 50 100 150 200 Mounting Interface Temperature (oC) Power (Watts) Insertion Loss Derating: The insertion loss, at a given frequency, of a group of couplers is measured at 25 °C and then averaged. The measurements are performed under small signal conditions (i.e. using a Vector Network Analyzer). The process is repeated at 85° C and 150°C. A best-fit line for the measured data is computed and then plotted from -55°C to 150°C. Power Derating: The power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. The thermal insertion loss is defined in the Power Handling section of the data sheet. As the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. If mounting temperature is greater than 95°C, Xinger coupler will perform reliably as long as the input power is derated to the curve above.

USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. Typical Performance (25°C): 2000-3000 MHz Coupling 1P620S -21.5 -21.0 -20.5 -20.0 -19.5 2000 2200 2400 2600 2800 3000 Frequency (MHz) Coupling (dB) Return Loss 1P620S -50 -40 -30 -20 -10 2000 2200 2400 2600 2800 3000 Frequency (MHz) Return Loss (dB) Directivity 1P620S -50 -40 -30 -20 -10 2000 2200 2400 2600 2800 3000 Frequency (MHz) Directivity (dB) Transmission Loss 1P620S -0.25 -0.20 -0.15 -0.10 -0.05 0.00 2000 2200 2400 2600 2800 3000 Frequency (MHz) Transmission Loss (dB)

Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 1P620 Rev C Definition of Measured Specifications Parameter Definition Mathematical Representation VSWR (Voltage Standing Wave Ratio) The impedance match of the coupler to a 50Ω system. A VSWR of 1:1 is optimal. VSWR = minV maxV Vmax = voltage maxima of a standing wave Vmin = voltage minima of a standing wave Return Loss The impedance match of the coupler to a 50Ω system. Return Loss is an alternate means to express VSWR. Return Loss (dB)= 20log 1 - VSWR

1 VSWR+

(ωn), coupling is the input power divided by the power at the coupled port. Mean coupling is the average value of the coupling values in the band. N is the number of frequencies in the band. Coupling (dB) = ⎟⎠⎜ = ) ) (log 10 ) ( n n in n P PC ω ωω ⎟⎞⎜ ⎝ (cpl Mean Coupling (dB) = N C N n ) (ω Insertion Loss The input power divided by the sum of the power at the two output ports. 10log direct cplP+ in P P Transmission Loss The input power divided by the power at the direct port. 10log direct P inP Directivity The power at the coupled port divided by the power at the isolated port. 10log isoP cplP Frequency Sensitivity The decibel difference between the maximum in band coupling value and the mean coupling, and the decibel difference between the minimum in band coupling value and the mean coupling. Max Coupling (dB) – Mean Coupling (dB) and Min Coupling (dB) – Mean Coupling (dB)

USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. Mounting In order for Xinger surface mount couplers to work optimally, there must be 50 Ω transmission lines leading to and from all of the RF ports. Also, there must be a very good ground plane underneath the part to ensure proper electrical performance. If either of these two conditions is not satisfied, electrical performance may not meet published specifications. Overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the PCB. This minimizes ground inductance and improves ground continuity. All of the Xinger hybrid and directional couplers are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17-25 ppm/ oC. When a surface mount hybrid coupler is mounted to a printed circuit board, the prim ary concerns are; ensuring the RF pads of the device are in contact with the circuit trace of the PCB and insuring the ground plane of neither the component nor the PCB is in contact with the RF signal. Mounting Footprint Coupler Mounting Process The process for assembling this component is a conventional surface mount process as shown in Figure 1. This process is conducive to both low and high volume usage. Figure 1: Surface Mounting Process Steps Storage of Components: Xinger products are available in either an immersion tin or tin-lead finish. Commonly used storage procedures used to control oxidation should be followed for these surface mount components. The storage temperatures should be held between 15 O C and O Substrate: Depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/°C. This coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as RF35, RO4003, FR4, polyimide and G-10 materials. Mounting to “hard” substrates (alumina etc.) is possible depending upon operational temperature requirements. The solder surfaces of the coupler are all copper plated with either an immersion tin or tin-lead exterior finish. Solder Paste: All conventional solder paste formulations will work well with Anaren’s Xinger surface mount components. Solder paste can be applied with stencils or syringe dispensers. An example of a stenciled solder paste deposit is shown in Figure 2. As shown in the figure solder paste is applied to the four RF pads and the entire ground plane underneath the body of the part. 1P620* Rev A Mounting Footprint Dimensions are in Inches [Millimeters] To ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part 4X .063 SQ [1.60] .170 [4.32]Multiple plated thru holes to ground .120 [3.05] 4X .034 [0.86] 4X 50 Ω Transmission Line

Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 1P620 Rev C PACKAGING Packaging follows EIA-481-2. Parts are oriented in tape as shown below. Minimum order quantities are 2000 per reel and 77 per tube. Xinger® Tape & Reel Diagram

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