1N5913BUR-1 MICROSEMI

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METALLURGICALLY BONDED GLASS SURFACE MOUNT 1.5 WATT ZENERS SCOTTSD A L E DIVISION 1N5913BUR-1 thru 1N5956BUR-1 (or MLL5913B thru MLL5956B) WWW.Microsemi .COM 1N5913BUR-1−1N5956BUR-1 DESCRIPTION APPEARANCE This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection for applications of hi gh density and l ow parasitic requirements. Due to its glass he rmetic qualitie s a nd metallu rgically enh anced internal contact s, it may also be used for high reliability applications when required by a source control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in Features below. Zener voltage tolerance options are identified by part n umber suffix including tig ht-tolerance. A variety of other Z ener product offerings and packages are available by Microsemi to m eet higher or lower power and test current applications. DO-213AB IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS

  • Electrically similar to the JEDEC registered 1N5913B thru 1N5956B zener series
  • Zener voltages available 3.3V to 200V
  • Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers, e.g. MX1N5913BUR-1, MV1N5923CUR-1, MSP1N5952DUR-1, etc.
  • Surface mount equivalents also available as SMBJ5913B to SMBJ5956B, SMBG5913B to SMBG5956B, SMAJ5913B to SMAJ5956B, or as 1PMT5913B to 1PMT5956B (see separate data sheets)
  • Plastic body axial-leaded Zener equivalents are also available as 1N5913BP to 1N5956BP (see separate data sheet)
  • Regulates voltage over a broad operating current and temperature range
  • Wide selection from 3.3 to 200 V
  • Leadless package for surface mounting
  • Ideal for high density mounting
  • Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance
  • Standard voltage tolerances are +/- 5% with B suffix and 10 % with A suffix identification
  • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively
  • Nonsensitive to ESD
  • Hermetically sealed glass package
  • Specified capacitance (see Figure 2)
  • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING
  • Power dissipation at 25ºC: 1.5 watts (also see derating in Figure 1).
  • Operating and Storage temperature: -65ºC to +175ºC
  • Thermal Resistance: 40 ºC/W junction to end cap, or 120ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page)
  • Steady-State Power: 1.50 watts at TEC < 115oC, or 1.25 watts at TA = 25ºC when mounted on FR4 PC board and recommended footprint as described for thermal resistance (also see Figure 1)
  • Forward voltage @200 mA: 1.2 volts (maximum)
  • Solder Temperatures: 260 ºC for 10 s (max)
  • CASE: Hermetically sealed DO-213AB glass MELF package
  • TERMINALS: End caps, tin-lead plated solderable per MIL-STD-750, method 2026
  • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation
  • MARKING: Cathode band only
  • TAPE & REEL optional: Standard per EIA-481-B with 12 mm tape, 1500 per 7 inch reel or 5000 per 13 inch reel (add “TR” suffix to part number)
  • WEIGHT: 0.05 grams
  • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1Copyright  2005 1-04-2005 REV D

METALLURGICALLY BONDED GLASS SURFACE MOUNT 1.5 WATT ZENERS SCOTTSD A L E DIVISION 1N5913BUR-1 thru 1N5956BUR-1 (or MLL5913B thru MLL5956B) WWW.Microsemi .COM 1N5913BUR-1−1N5956BUR-1 ELECTRICAL CHARACTERISTICS @ TEC = 25oC unless otherwise noted* ZENER VOLTAGE VZ (Note 2) TEST CURRENT IZT DYNAMIC IMPEDANCE ZZT (Note 3) KNEE CURRENT IZK KNEE IMPEDANCE ZZK (Note 3) REVERSE CURRENT IR REVERSE VOLTAGE VR MAX. DC CURRENT IZM MICROSEMI PART NUMBER (Note 1 &4) Volts mA Ohms mA Ohms µAdc Volts mA 1N5913BUR-1 1N5914BUR-1 1N5915BUR-1 1N5916BUR-1 3.3 3.6 3.9 4.3 113.6 104.2 96.1 87.2 9.0 7.5 6.0 1.0 1.0 1.0 1.0 500 500 500 500 100 5.0 1.0 1.0 1.0 1.0 454 416 384 348 1N5917BUR-1 1N5918BUR-1 1N5919BUR-1 1N5920BUR-1 4.7 5.1 5.6 6.2 79.8 73.5 66.9 60.5 5.0 4.0 2.0 2.0 1.0 1.0 1.0 1.0 500 350 250 200 5.0 5.0 5.0 5.0 1.5 2.0 3.0 4.0 319 294 267 241 1N5921BUR-1 1N5922BUR-1 1N5923BUR-1 1N5924BUR-1 6.8 7.5 8.2 9.1 55.1 50.0 45.7 41.2 2.5 3.0 3.5 4.0 1.0 0.5 0.5 0.5 200 400 400 500 5.0 5.0 5.0 5.0 5.2 6.0 6.5 7.0 220 200 182 164 1N5925BUR-1 1N5926BUR-1 1N5927BUR-1 1N5928BUR-1 37.5 34.1 31.2 28.8 4.5 5.5 6.5 7.0 0.25 0.25 0.25 0.25 500 550 550 550 5.0 1.0 1.0 1.0 8.0 8.4 9.1 9.9 150 136 125 115 1N5929BUR-1 1N5930BUR-1 1N5931BUR-1 1N5932BUR-1 25.0 23.4 20.8 18.7 9.0 0.25 0.25 0.25 0.25 600 600 650 650 1.0 1.0 1.0 1.0 11.4 12.2 13.7 15.2 100 1N5933BUR-1 1N5934BUR-1 1N5935BUR-1 1N5936BUR-1 17.0 15.6 13.9 12.5 17.5 0.25 0.25 0.25 0.25 650 700 700 750 1.0 1.0 1.0 1.0 16.7 18.2 20.6 22.8 1N5937BUR-1 1N5938BUR-1 1N5939BUR-1 1N5940BUR-1 11.4 10.4 9.6 8.7 0.25 0.25 0.25 0.25 800 850 900 950 1.0 1.0 1.0 1.0 25.1 27.4 29.7 32.7 1N5941BUR-1 1N5942BUR-1 1N5943BUR-1 1N5944BUR-1 8.0 7.3 6.7 6.0 100 0.25 0.25 0.25 0.25 1000 1100 1300 1500 1.0 1.0 1.0 1.0 35.8 38.8 42.6 47.1 1N5945BUR-1 1N5946BUR-1 1N5947BUR-1 1N5948BUR-1 5.5 5.0 4.6 4.1 120 140 160 200 0.25 0.25 0.25 0.25 1700 2000 2500 3000 1.0 1.0 1.0 1.0 51.2 56.0 62.2 69.2 1N5949BUR-1 1N5950BUR-1 1N5951BUR-1 1N5952BUR-1 100 110 120 130 3.7 3.4 3.1 2.9 250 300 380 450 0.25 0.25 0.25 0.25 3100 4000 4500 5000 1.0 1.0 1.0 1.0 76.0 83.6 91.2 98.9 1N5953BUR-1 1N5954BUR-1 1N5955BUR-1 1N5956BUR-1 150 160 180 200 2.5 2.3 2.1 1.9 600 700 900 1200 0.25 0.25 0.25 0.25 6000 6500 7000 8000 1.0 1.0 1.0 1.0 114.0 121.6 136.8 152.0 * TEC Maintained at 30oC, VF = 1.2V max @ IF = 200 mA (all types). NOTE 1: No suffix indicates a +/-20% tolerance on nominal VZ. The suffix A denotes +/-10%, the standard suffix B denotes +/-5%, C denotes +/-2%, and D denotes +/-1% tolerance. NOTE 2: Zener voltage (VZ) is measured at end cap temperatures TEC = 30oC. Voltage measurement to be performed 90 seconds after application of dc current. NOTE 3: The zener impedance is derived from the 60 Hz ac voltage, which results when an ac current having an rms value equal to 10% of the dc zener current (IZT or IZK) is superimposed on IZT or IZK. NOTE 4: This product series has also been previously identified as the MLL5913B thru MLL5956B series that included the enhanced metallurgical bond. This alternate name may still be used. Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 2Copyright  2005 1-04-2005 REV D

METALLURGICALLY BONDED GLASS SURFACE MOUNT 1.5 WATT ZENERS Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 3Copyright  2005 1-04-2005 REV D WWW.Microsemi .COM SCOTTSD A L E DIVISION 1N5913BUR-1 thru 1N5956BUR-1 (or MLL5913B thru MLL5956B) 1N5913BUR-1−1N5956BUR-1 GRAPHS STEADY-STATE POWER DERATING PD Power Dissipation (WATTS) TA TEC T emperature (oC) FIGURE 2 FIGURE 1 Power Derating Curve Where TEC is End Cap Temp and TA is Ambient Temperature on FR4 PC board. PACKAGE DIMENSIONS PAD LAYOUT INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.094 0.105 2.39 2.66 B 0.189 0.205 4.80 5.20 C 0.016 0.022 0.41 0.55 INCHES mm A .276 7.00 B 0.070 1.8 C 0.110 2.8