1N4150-1JANTX MICROSEMI

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 2

Technical content

Limits I F = 1 mA dc I F = 10 mA dc I F = 50 mA dc I F = 100 mA dc I F = 200 mA dc (Pulsed) (Pulsed) (Pulsed) V dc V dc V dc V dc V dc Type V BR V RWM I R1 1 R2 Ct rr VR = 50 V dc V R = 50 V dc V R = 0; f = 1 Mhz; I F= IR= 10 to 100 mA dc IR = 10 µA T A = 25°C T A = 150°C ac signals = 50 mV (p-p) RL = 100 ohms V dc V (pk) µA dc µA dc pF ns 1N3600 75 50 0.1 100 2.5 4 1N4150,-1 75 50 0.1 100 2.5 4

6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841

PHONE (978) 620-2600 FAX (781) 689-0803 WEBSITE: http://www.microsemi.com 1N4150 and 1N4150-1 and 1N3600 MAXIMUM RATINGS Junction Temperature: -65°C to +175°C Storage Temperature: -65°C to +175°C Operating Current: 300 mA @ T A = +25°C Derating: 2.0 mA dc/°C Above T L = + 75°C @ L = 3/8” Forward Surge Current: 4A, (tp = 1µs); 0.5A (tp = 1s) ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise speci½ed.

  • 1N4150-1 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/231
  • 1N3600 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/231
  • SWITCHING DIODES
  • HERMETICALLY SEALED
  • METALLURGICALLY BONDED
  • DOUBLE PLUG CONSTRUCTION FIGURE 1 DESIGN DATA CASE: Hermetically sealed glass case per MIL-S-19500/231 D0-35 outline. LEAD MATERIAL: Copper clad steel. LEAD FINISH: Tin / Lead THERMAL RESISTANCE: (RO JL): 250 °C/W maximum at L = .375 THERMAL IMPEDANCE: (ZOJX): 70 °C/W maximum POLARITY: Cathode end is banded. MOUNTING POSITION: Any. FORWARD VOLTAGE LIMITS – ALL TYPES