1N4001W SKTECHNOLGY

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Technical content

Ratings at 25 ambient temperature unless otherwise specified.Single phase half-wave 60 H z, resistive or inductive load, for capacitive load current derate by 20 %. Maximum DC Blocking Voltage Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Maximum Instantaneous Forward Voltage at 1 A Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Operating and Storage Temperature Range Maximum Average Forward Rectified Current at Ta = 65 °C Maximum DC Reverse Current Ta = 25 °C at Rated DC Blocking Voltage Ta =125 °C 1）Typical Junction Capacitance VRRM VRMS VDC IF(AV) IFSM VF IR 50 100 200 400 600 800 1000 V 35 70 140 280 420 560 700 V 50 100 200 400 600 800 1000 V 1.1 180 -55 ~ +150 A A V μA pF Maximum Ratings and Electrical characteristics Surface Mount General Purpose Silicon Rectifiers Reverse Voltage - 50 to 1000 V Forward Current - 1 A 1N4001W 1N4002W 1N4003W 1N4004W 1N4005W 1N4006W 1N4007W Typical Thermal Resistance RθJA Measured at 1 MHz and applied reverse voltage of 4 V D.C °C/W Cj T , Tj stg Symbols Units PINNING PIN

DESCRIPTION

Marking Code： A1-A7 Weight：17mg，0.0006 oz Simplified outline SOD-123FL and symbol 1 2 A 7 1N4001W THRU 1N4007W 1 of 4 REV.08

0.1 Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) 0.7 1.0 T =25 J T =150 J T =100 J 0.2 0.5 Fig.2 Typical Instaneous Reverse Characteristics Instaneous Current ( A)Reverse μ 200 400 600 8000 0.01 0.1 1.0 Instaneous Reverse Voltage (V) 100 T =25J °C T =50J °C T =75J °C T =100J °C T =125J °C T =150J °C Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Reverse Voltage (V) 5 10 20 25 30 35 40 0.2 0.4 0.6 0.8 1.0 1.2 0.0 25 50 75 100 125 150 175 Fig.1 Forward Current Derating Curve Average Forward Current (A) Ambient Temperature (°C) Single phase half-wave 60 Hz resistive or inductive load 1N4001W THRU 1N4007W 2 of 4 REV.08

Plastic surface mounted package; 2 leads SOD123FL A A C ∠ALL ROUND V AM e UNIT mm max min mil max min 7.9 4.7 114 102 150 138 A C D E HE ∠ 1.1 0.8 e Bottom View HE ∠ALL ROUND E D E g pad pad Top View 0.9 0.7 g g The recommended mounting pad size 2.0 (79) 1.2 (47) mm (mil)Unit： 1.2 (47) 1.2 (47) 1N4001W THRU 1N4007W 3 of 4 REV.08

  • Recommended condition of flow soldering 2 to 5 min more than 1 min less than 10s 100°C 120°C 245°C 265°C Temperature of Soldering (°C) Preliminary Heating Soldering Cooling (in air) 100 150 200 250 300
  • Recommended condition of reflow soldering Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) Temperature: 370°C Time: 3s max. Times: one time
  • Condition of hand soldering
  • Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) Temperature of Soldering (°C) Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s Reflow Heating Rate 1 to 5°C / s Peak Temperature 245 to 260°C, 10s max. 100 150 200 250 300 2 times max. 1N4001W THRU 1N4007W 4 of 4 REV.08