157 LITTELFUSE

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

Features

Electrical Characteristics for Series

  • Surface Mountable, Very Fast Acting Fuse.
  • Fully compatible with RoHS/Pb-Free solder alloys and higher temperature profiles associated with leadfree assembly.
  • Easily replaceable on PC Board (Field Replaceable)
  • RoHS compliant and Halogen Free
  • Available in ratings of 0.062 ~ 10 Amperes. % of Ampere Rating Opening Time at 25ºC 100% 4 hours Minimum 200% 5 secs. Maximum

Applications

Electrical Specifications by Item 1 . Cold resistance measured at less than 10% of rated current at 23ºC. 2. I2t values stated for 8ms opening time. 3. Agency Approval Table Key: X=Approved or Certified, P=Pending and Blank=Not Approved 4. Have special electrical characteristic needs? Contact Littelfuse to learn more about application specific options. RoHS

  • Instrumentation
  • Base Stations
  • Telecommunications PS E Ampere Rating (A) Amp Code Max Voltage Rating (V) Interrupting Rating (A) Fuse Furnished Nominal Cold Resistance (Ohms) Nominal Melting I2t (A2sec) Agency Approvals PS E 0.062 .062 125 50A @ 125 VAC/VDC 300A @ 32 VDC 0451 .062 5.5372 0.00019 X 10.0 010. 125 35A @ 125 VAC / 50A @125 VDC 300A @ 32VDC 0453010. 0.0058 26.46 X X Specifications are subject to change without notice. Application testing is strongly recommended.

© 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15 Surface Mount Fuses NANO2® > 157 Fuse and Holder Combination Average Time Current Curves Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (Min to Max) (ts) 60 – 120 secs Average ramp up rate (Liquidus Temp (TL) to peak 5°C/second max. TS(max) to TL - Ramp-up Rate 5°C/second max. Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 90 seconds Peak Temperature (TP) 260+0/–5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max. Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C Soldering Parameters T emperature Re-rating Curve 0.001 0.01 0.1 100 0.01 0.1 1 10 100 1000 10000 TIME IN SECONDS CURRENT IN AMPS 10A 5A 6.3A 3.5A 3.15A 2.5A 1.5A 1.25A 800mA 750mA 630mA 500mA 375mA 400mA 315mA 250mA 200mA 100mA 125mA 160mA 80mA 62mA 1.6A Note: 1 . Rerating depicted in this curve is in addition to the standard derating of 25% for continuous operation. Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP

© 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15 Surface Mount Fuses NANO2® > 157 Fuse and Holder Combination Materials Body: Ceramic Cap: For 0.062A ~ 0.125A – Au plated Brass For 0.200A ~ 10A – Silver plated Brass Clip Plating: Matte Tin Product Marking Body: Brand Logo, Current Rating Clip Retention Force applied at fuse center, perpendicular to the long axis (@ 0.75 lbs. MIN) Solderability MIL -STD-202, Method 208 / IPC/ EIA / JEDEC J-STD-002, Test Condition A Humidity T est MIL –STD-202, Method 103 @ 85ºC / 85%RH, 1000 hours Resistance to Solvents MIL -STD-202, Method 215 (3 solvent types) Product Characteristics Operating T emperature -55ºC to 125ºC with proper derating Thermal Shock MIL -STD-202, Method 107 , Test Condition B (5 cycles -65ºC to +125ºC) Vibration MIL -STD-202, Method 201 (10-55 Hz) Moisture Resistance MIL -STD-202, Method 106, 10 cycles Salt Spray/ Atmosphere MIL -STD-202, Method 101, Test Condition B (48 hrs.), 5% NaCl in De-ionized Water Shock MIL -STD-202, Method 213, Test Condition I (100 G’s peak for 6 milliseconds) Dimensions 6.10 [0.240] 1.45 [0.057] 2.69 [0.106] 2.69 [0.106] 3.7 ± 0.13 [0.146]L 1AF 6.50 ± 0.20 [0.256] 7.26 [0.29] 3.00 [0.12] 2.46 [0.10] 2.40 [0.09] 3.70 [0.146] 3.40 [0.134] 3.90 ± 0.13 [0.154] 2.50 ± 0.2 [0.098] "A" "B" 0.10 Part Numbering System PCB Recommendation for Thermal Management 1 . Minimum Copper Layer Thickness = 100um 2. Minimum Copper Trace Width = 10mm 0157 001. D R SERIES AMP CODE QUANTITY CODE PACKING OPTION D = 1500 pcs R = Tape and Reel Note: Alternate methods of thermal management may be used. In such cases, under normal operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC ambient environment. Packaging Packaging Option Packaging Specification Quantity Quantity & Packaging Code Tape and Reel Surface Mount 1500 DR Additional Information Datasheet SamplesResources