12-22-G6R8C-A30-2C TO-GRACE
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 12
Technical content
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao T echnical Data Sheet Right Angle Lens Chip LEDs with Bi-Color(Multi-Color) 2-22/G6R8C-A30/2C F eatures ackage in 8mm tape on 7〞diameter reel. ompatible with automatic placement equipment. ompatible with infrared and vapor phase reflow solder process. ulti-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version. Descriptions he 12-22 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
acklighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. D evice Selection Guide C hip Emitted Color Resin Color T ype Material G
6 AlGaInP Brilliant Yellow Green
W ater Clear R
8 AlGaInP Deep - Red
香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦，贴片LED灯等 进口原装，现货供应，价格优势，技术支持 电话：0755-83464948 传真：0755-83464076 A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Package Outline Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Absolute Maximum Ratings (Ta=25℃℃ ℃℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF R8:25 G6:25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP R8:60 G6:60 mA Power Dissipation Pd R8:60 G6:60 mW Electrostatic Discharge(HBM) ESD R6:2000 G6:2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec. H and Soldering : 350 ℃ for 3 sec. A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Electro-Optical Characteristics (Ta=25℃℃ ℃℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity IV 45.0 22.5 ----- ----- 90.0 57.0 mcd IF=20mA Viewing Angle 2θ1/2 ----- 120 ----- deg Peak Wavelength λp ----- 650 575 ----- nm Dominant Wavelength λd G ----- ----- 639 573 ----- ----- nm Spectrum Radiation Bandwidth ----- ----- nm Forward Voltage VF 1.70 1.70 2.00 2.00 2.40 2.40 V Reverse Current IR ----- ----- μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±±±±11% A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Bin Range Of Luminous Intensity Bin Min Max Unit Condition P1 45.0 57.0 mcd I F=20mA P2 57.0 72.0 Q1 72.0 90.0 Bin Min Max Unit Condition 1 22.5 36.0 mcd I F=20mA 2 36.0 57.0 Notes: 1.Tolerance of Luminous Intensity ±±±±11% A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Typical Electro-Optical Characteristics Curves A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Typical Electro-Optical Characteristics Curves A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm, Unit = mm RoHS Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX CAT : XXX HUE : XXX REF : XXX EVERLIGHT MADE IN TAIWAN A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm, Unit = mm Moisture Resistant Packaging Label Desiccant LabelAluminum moisture-proof bag A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% L TPD：10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 PCS. 0/1
2 Temperature Cycle
H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1
5 Low Temperature
Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS. 0/1
7 High Temperature /
High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1 A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. .3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. I f unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. . Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. A ll data sheet.com
Device No. Prepared date: 30-Jun-2011 Prepared by: Haizheng Gao 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds w ithin once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com A ll data sheet.com