12-215-BHC-XL1M2HY-3C TO-GRACE

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 10

Technical content

Features

․Package in 8m m tape on 7〞diameter reel. ․Com patible with automatic placement equipment. ․Com patible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will rem ain within RoHS complaint version Descriptions ․The 12-215 SMD LED is m uch smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc.

Applications

․Backlighting in dashboard and switch. ․Telecom munication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Chip Part No. Material Emitted Color Resin Color 12-215/BHC-XL1M2HY/3C InGaN Blue Water Clear 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦,贴片LED灯等 进口原装,现货供应,价格优势,技术支持 电话:0755-83464948 传真:0755-83464076 A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 2 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Package Outline Dimensions CL R0.5 LC 0.5 1.0 0.6 1.7 2.1 0.8 1.3 0.8 0.35 0.9 0.3 1.5 0.3 Cathode Mask Note: The tolerances unless mentioned is ±0.1mm, Unit = mm A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 3 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 95 mW Electrostatic Discharge(HBM) ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Reflow Soldering :260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 11.5 ----- 28.5 mcd Viewing Angle 2 θ1/2 ----- 130 ---- deg Peak Wavelength λp ---- 468 ---- nm Dominant Wavelength λd 465.0 ----- 470.0 nm Spectrum Radiation Bandwidth △λ ----- 25 ---- nm Forward Voltage V F 2.70 ----- 3.15 V IF=5mA Reverse Current I R ---- ---- 50 μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 4 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Bin Range Of Dom. Wavelength Groups Bin Min Max Unit Condition X x 465.0 470.0 nm I F=5mA Bin Range Of Luminous Intensity Bin Min Max Unit Condition L1 11.5 14.5 L2 14.5 18.0 M1 18.0 22.5 M2 22.5 28.5 mcd I F=5mA Bin Range Of Luminous Voltage Groups Bin Min Max Unit Condition 15 2.70 2.85 16 2.85 3.00 H 17 3.00 3.15 V I F=5mA Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 5 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Electro-Optical Characteristics (Ta=25℃) A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 6 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm RoHS Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX CAT : XXX HUE : XXX REF : XXX EVERLIGHT MADE IN TAIWAN A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 7 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Aluminum moistue-proof bag LabelDesiccantLabel A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 8 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 PCS. 0/1

2 Temperature Cycle

H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1

3 Thermal Shock

H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1

4 High Temperature

Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1

5 Low Temperature

Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS. 0/1

7 High Temperature /

High Humidity 85℃/ 85% RH 1000 Hrs. 22 PCS. 0/1 A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 9 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30 ℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. A ll data sheet.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 10 of 10 Device No:DSE-0001654 Prepared date: 5-Jun. -2009 Prepared by:Xie Haitao 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 ℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiw an, R.O.C http://www.everlight.com A ll data sheet.com