11-22-R6G6C-A01-2T TO-GRACE
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 9
Technical content
ww.everlight.com S MD /square4 B 1-22/R6G6C-A01/2T F eatures ․Package in 8mm tape on 7〞diameter reel. ompatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version.
Description
․The 11-22 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. A pplications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦，贴片LED灯等 进口原装，现货供应，价格优势，技术支持 电话：0755-83464948 传真：0755-83464076 A ll data sheet.com
Materials Emitted Color Resin Color AlGaInP Brilliant Red Water Clear AlGaInP Brilliant Yellow Green Absolute Maximum Ratings (Ta=25℃℃ ℃℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF R6:25 G6:25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP R6:60 G6:60 mA Power Dissipation Pd R6:60 G6:60 mW Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Electrostatic Discharge ESD HBM R6:2000 G6:2000 V Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 30 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃℃ ℃℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv R6 140 225 72 ----- mcd I F=20mA Viewing Angle 2θ1/2 ----- 60 ----- deg I F=20mA Peak Wavelength λ p R6 G6 ----- 632 575 ----- nm I F=20mA Dominant Wavelength λ d R6 G6 ----- 624 573 ----- nm I F=20mA Spectrum Radiation Bandwidth △λ R6 G6 ---- 20 ---- nm I F=20mA Forward Voltage VF R6 1.7 1.7 2.0 2.0 2.4
2.4 V I
F=20mA Reverse Current IR R6 G6 ----- ----- 10 µA V R=5V A ll data sheet.com
Typical Electro-Optical Characteristics Curves A ll data sheet.com
Typical Electro-Optical Characteristics Curves Ta=25°C Relative luminous intensity Ambient Temperature T (°C )a % )( Relative luminous intensity( ) % Wavelength λ(nm) Ta=25°C Forward Voltage V (V)F Forward Current I (mA)Relative luminous intensity ( ) % Forward Current I (mA) Ta=25°C Ambient Temperature T (°Ca ) Forward Current I (mA) Ta=25°C A ll data sheet.com
Package Outline Dimensions A ll data sheet.com
Moisture Resistant Packing Materials Label Explanation ‧ CAT: Luminous Intensity Rank ‧ HUE: Dom. Wavelength Rank ‧ REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm RoHS Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX CAT : XXX HUE : XXX REF : XXX EVERLIGHT MADE IN TAIWAN A ll data sheet.com
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label Desiccant LabelAluminum moisture-proof bag A ll data sheet.com
- Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. .3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. I f unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. . Soldering Condition
3.1 Pb-free solder temperature profile
150~200°C 60~120sec. 3°C/sec.Max. Above 217°C 60~150sec. 260°C Max. 10sec. Max. 6°C/sec.Max. Above255°C 30sec.Max. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. A ll data sheet.com
4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once i n less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com A ll data sheet.com