0603JBCT HB
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 10
Technical content
Part No. : 0603JBCT REV:A / 03 z PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm (.004") unless otherwise noted. z Features ½ Top view, wide view angle, single color Chip LED. ½ Package in 8mm tape on 7" diameter reels. ½ Compatible with automatic Pick & Place equipment. ½ Compatible with Infrared and Wave soldering reflow solder processes. ½ EIA STD package. ½ I.C. compatible. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 1 of 10
Part No. : 0603JCT REV:A / 03 z Chip Materials ½ Dice Material : InGaN ½ Light Color : Blue ½ Lens Color : Water Clear z Absolute Maximum Ratings(Ta=25℃) Symbol Parameter Rating Unit PD Power Dissipation 100 mW IPF Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 100 mA IF Continuous Forward Current 25 mA - De-rating Linear From 25℃ 0.25 mA/℃ VR Reverse V oltage 5 V ESD Electrostatic Discharge Threshold(HBM) Note A 150 V Topr Operating Temperature Range -40 ~ +85 ℃ Tstg Storage Temperature Range -40 ~ +85 ℃ - Wave Soldering Condition (Two times Max.) 260 (for 5 seconds) ℃ - Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds) ℃ Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. z Electro-Optical Characteristics(Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Test Condition Luminous Intensity IV 25.0 40.0 80.0 mcd IF=20mA Viewing Angle 2θ1/2 130 deg Note 2 Peak Emission Wavelength λp 468 nm Measurement @Peak Dominant Wavelength λd 470 nm IF=20mA Spectral Line Half-Width Δλ 25 nm Forward V oltage VF 3.3 3.8 V IF = 20mA Reverse Current IR 50 μA VR = 5V DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 2 of 10
Part No. : 0603JBCT REV:A / 03 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the lu minous intensity is half the axial luminous intensity. 3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD : Static Electricity and surge damages the LED. It is recommend use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. z Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 3 of 10
Part No. : 0603JBCT REV:A / 03 z Typical Electro-Optical Characteristics Curves (25℃Ambient Temperature Unless Otherwise Noted) Relative luminous intensity(%)1 Fig.6 Forward Current Derating Curve Ambient Temperature Ta(℃) 0 20 60 80 100 Fig.4 Relative Luminous Intensity vs.Forward Current Forward Current IF(mA) 0.7 80° 90° Fig.7 Relative Intensity vs.Angle Fig.5 Luminous Intensity vs.Ambient Temperature 70° 60° 50° 40° 30° 100 0.8 0.9 1.0 Ambient Temperature Ta(℃) -0-60 -20-40 10° 0° 20° 60 20408 0 Luminous lntensity(mcd) Fig.2 Forward Current vs.Forward Voltage Relative Luminous lntensity Normalized of 20mA Fig.3 Luminous Intensit y vs.Forward Current 100 1000 DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 4 of 10
Part No. : 0603JBCT REV:A / 03 z L a b e l E x p l a n a t i o n BATCH: L1 B9 AC L1: Luminous Intensity Code B9: Forward Voltage Code AC: Dom Wavelength Code z Reel Dimensions Notes: 1. Taping Quantity : 4000PCS 2. The tolerances unless mentioned is±0.1mm, Angle ±0.5°, Unit : mm. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 5 of 10
Part No. : 0603JBCT REV:A / 03 z Package Dimensions Of Tape And Reel Polarity Progressive direction Cathode Notes:All dimensions are in millimeters. Moisture Resistant Packaging LIGHT LIGHT Label Aluminum moistue-proof bag Desiccant Label 255 435 145 240 Label Box Carton Reel Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 6 of 10
Part No. : 0603JBCT REV:A / 03 z Cleaning ½ If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. ½ Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. ½ Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. z Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace z Suggest IR Reflow Soldering Profile Condition: +5℃/sec (MAX) Cooling -5℃/sec (MAX) Time 240° C(MAX) CC Rising +5℃/sec (MAX) Temperature(℃) DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 7 of 10
Part No. : 0603JBCT REV:A / 03 z Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Forward V oltage(VF), Unit:V@20mA Bin Code Min Max Bin Code Min Max M 16.0 32.0 K9 2.95 3.15 N 25.0 50.0 K10 3.05 3.30 P 40.0 80.0 K11 3.20 3.45 K12 3.35 3.60 I n c l u d i n g t e s t t o l e r a n c e I n c l u d i n g t e s t t o l e r a n ce Dominant Wavelength (Hue),Unit: nm@20mA Bin Code Min Max AC 464 471 AD 469 476 Including±1nm test tolerance z CAUTIONS 1.Application Limitation : The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application).Consult HB’s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage : Before opening the package : The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year. After opening the package : The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 8 of 10
Part No. : 0603JBCT REV:A / 03 Wave soldering : Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1 st and 2nd soldering processes. 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp:150-180℃,120sec.Max. 2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max. 3、Peak Temperature:260℃，5sec. 4、Reflow Repetition:2 Times Max. 5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp:350℃ Max. 2、Soldering Iron:30w Max. 3、Soldering Time:3 Sec. Max. One Time. For Dip Soldering : 1、Pre-Heat Temp:150℃ Max. 120 Sec. Max. 2、Bath Temp:265℃ Max. 3、Dip Time:5 Sec. Max. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 9 of 10
Part No. : 0603JBCT REV:A / 03 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED\`s could be found due to the Vf-If characteristics of LED. 6.Reliability Test Classification Test Item Test Condition Reference Standard Operation Life Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) High Temperature High Humidity Storage IR-Reflow In-Board, 2 Times *Test Time= 1000HRS±2HRS MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) High Temperature Storage Ta= 105±5℃ Test Time= 1000HRS (-24HRS,72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Endurance Test Low Temperature Storage Ta= -55±5℃ *Test Time=1000HRS (-24HRS,72H RS) JIS C 7021:B-12 (1982) Temperature Cycling 105±5℃ - 5 5 ± 5℃ 10mins 10mins 100 Cycles MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) Thermal Shock IR-Reflow In-Board, 2 Times 10mins 10mins 100 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Solder Resistance Tsol= 260 ± 5℃ Dwell Time= 10 ± 1sec MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) Environmental Test Solder ability Tsol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982) 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-74-03-0008 DATE : 2004-06-07 PAGE 10 of 10