0603ESDA2TR2 COOPER

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Technical content

Features

 Lead free, halogen free materials  0603/1608 footprint surface mount device  Ideal ESD protection for high frequency, low voltage applications  Exceeds testing requirements of IEC 61000-4-2  Ultra low capacitance (0.15pF maximum)  Very low leakage current  Fast response time  Bi-directional Specifications Performance Characteristics Units Min Typ Max Continuous Operating Voltage Vdc - - 14 30 Clamping Voltage1 V- -3 5 6 0 Trigger Voltage2 V - - 350 - - ESD Threat Voltage Capability kv - - 8 15 Capacitance (@ 1MHz) pF - - 0.10 0.15 Leakage Current (@ 12Vdc) nA - - <0.1 100 Peak Current A - - 30 Typ. 45 Operating Temperature °C -55 +25 +105 ESD Pulse Withstand # Pulses 20 >500 - - 1. Per IEC 61000-4-2, 30A @ 8kV, Level 4, contact discharge, measurement made 30ns after initiation of pulse. 2. Trigger measurement made using Transmission Line Pulse (TLP) method. Device Marking PolySurg™ ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required. Design Consideration The location in the circuit for the 0603ESDA2-TR2 Series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). Processing Recommendations The 0603ESDA2-TR2 Series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the device. They can be processed using standard pick-and-place equipment. The placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors. Pb HALOGEN HFFREE Package Code Suffix Description -TR2 5000 pieces in paper tape on 7 inch diameter (178mm) reel per EIA Standard 481

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0612 BU-SB12433 Page 2 of 2 Data Sheet 4419

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. Al l other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Tc -5°C t Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Preheat AreaTsmax Tsmin ts Tp TL Temperature Time Time 25°C to Peak Supplier Tp > Tc- Supplier tp Tc User Tp < Tc- User tp Tc -5°C tp Soldering Recommendations  Compatible with lead and lead-free solder reflow processes  Peak temperatures and durations: - IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow. - Wave Solder = 260°C max. for 10 sec. max. - Hand Soldering = 350°C max. for 5 sec. max. Recommended IR Reflow Profile Tape and Reel Specifications - mm (in) W L HT 1.0 max (0.039 max) 1.1 ref (0.043 ref) 0.60 mi n (0.023 min) (per IPC-SM-782 ) Recommended Pad Layout - in (mm) Environmental Specifications:  Coating bond strength: ASTM D3359-83, Method A, Section 6. Note: the device coating is not scored.  Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H 2O, detergent solution, defluxer).  Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C, 240 hrs.  Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30 min, 5 cycles.  Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute cycle, 2 hrs. each in X-Y-Z axis).  Solder leach resistance and terminal adhesion per EIA-567.  Solderability per MIL-STD-202, Method 208 (95% coverage).  Full load voltage: 14.4Vdc, 1000hrs., 25°C.  Operating temperature characteristics: Electrical testing at +105°C and -55°C. Dimensions - mm (in) Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) 100°C 150°C Temperature max (Tsmax) 150°C 200°C Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 seconds 60-150 seconds Peak package body temperature (Tp)* See classification temp See classification temp in Table 4.1 in Table 4.2 Time (tp) within 5°C of the specified 20 seconds 30** seconds classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 6°C/second max. 6°C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.