046802.5NR LITTELFUSE

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 3

Technical content

Features

  • Complies with electronic industry environmental standards for lead reduction.
  • Product is compatible with lead-free solders and higher temperature profiles.
  • Time delay feature withstands high inrush currents and prevents nuisance openings.
  • Package is visually distinct from fast- acting version for easy identification.
  • Top side marking allows visual verification of amperage rating. % of Ampere rating Opening Time at 25Oc 100% 4 hours, Minimum 200% 1 sec., Min.; 120 sec., Max.

Applications

(A) Amp code max Voltage rating (V) interrupting rating nominal cold resistance (Ohms) nominal melting i2t (A2sec) nom Voltage Drop (mV) nom power Dissipation (W) Agency Approvals 0.50 .500 63 50 amperes @63 VAC/VDC 0.27000 0.0310 156.77 0.0784 x x 2.00 002. 63 35 amperes @63 VAC 50 amperes @63 VDC 0.03240 0.5060 77.27 0.1545 x x 3.00 003. 32 50 amperes @32 VAC/VDC 0.01950 1.2700 72.95 0.2189 x x Electrical Specifications by Item 1. Measured at 10% of rated current, 25˚C. 2. Measured at rated voltage. The 468 Series Time-Lag (Slo-Blo®) SMF is a small (1206 size) thin-film device designed for secondary protection of circuits used in space constrained applications such as hand-held portable electronic devices. This series is 100% lead-free and meets the requirements of the RoHS directive. New Halogen-Free 468 Series fuses are available–to order use the “HF” suffix. See Part Numbering section for additional information.

  • Cell phones
  • Battery packs
  • Digital cameras
  • DVD players
  • Hard disk drives. Secondary protection for space constrained applications: Revised: October 4, 2011

Introduction to Circuit ProtectionIntroduction to Circuit Protection Transientology 38 © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Surface Mount Fuses

468 Series

Thin Film > 1206 Size > Slo-Blo® > 468 Series Please refer to www.littelfuse.com/series/468.html for current information. Average Time Current Curves 0.001 0.01 0.1 100 0010110 Current in Amperes Time in Seconds 2.5A 1.5A .5A Temperature Rerating Curve reflow condition Pb – Free assembly pre Heat - Temperature min (Ts(min)) 150°C - Temperature max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (liquidus Temp (Tl) to peak 5°C/second max TS(max) to Tl - ramp-up rate 5°C/second max reflow - Temperature (Tl) (liquidus) 217°C - Temperature (tl) 60 – 150 seconds peak Temperature (Tp) 250+0/-5 °C Time within 5°c of actual peak Temperature (tp) 20 – 40 seconds ramp-down rate 5°C/second max Time 25°c to peak Temperature (Tp) 8 minutes Max. Do not exceed 260°C Soldering Parameters Wave Soldering 260°C, 10 seconds max. Note: 1. Derating depicted in this curve is in addition to the standard derating of 25% for continuous operation. Example: For continuous operation at 70 degrees celsius, the fuse should be deratedas follows: I = (0.75)(0.80)IRAT = (0.60)IRAT 2. The temperature derating curve represents the nominal conditions. For questions about temperature derating curve, please consult Littelfuse technical support for assistance. Time Te mperature TP TL TS(max) TS(min) tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP

39© 2009 Littelfuse, Inc. Specifications are subject to change without notice. Surface Mount Fuses Thin Film > 1206 Size > Slo-Blo® > 468 Series Please refer to www.littelfuse.com/series/468.html for current information. Body: Epoxy Substrate Terminations: 100% Tin over Nickel over Copper Element Cover Coat: Conformal Coating Operating Temperature –55OC to 90OC. Consult temperature rerating curve chart. For operation above 90°C please contact Littelfuse Thermal Shock Withstands 5 cycles of – 50OC to 125OC Humidity MIL-STD-202F, Method 103B, Condition D Vibration Withstands 10-55 Hz per MIL-STD- 202F, Method 201A and 10-2000 Hz at 20 G’s per MIL-STD- 202F, Method 204D, Condition D Insulation Resistance (After Opening) Greater than 10,000 ohms. Resistance to Soldering Heat MIL-STD-202G, Method 210F, Condition D Product Characteristics Dimensions Part Marking System MARKING CODE VARIES WITH AMPERA GE RATING (SEE CHAR T) .58 (.023") Coating .66 (.026") 2.03 (.080") 2.03 (.080") WAVE SOLDER INFARED SOLDER 3.81 (.150") 1.52 (.060") 1.14 (.045") 4.83 (.190") 1.65 (.065") 1.52 (.060") 3.18 (.125") 1.52 (.060") 1.27 (.050") Part Numbering System Packaging packaging Option packaging Specification Quantity Quantity & packaging code Tape & Reel – 8mm tape EIA-481 Rev. D (IEC 60286, part 3) 5000 NR Amp code marking code .500 TF 001. TH 01.5 TK 002. TN 02.5 TO 003. TP 0468002.NRHF SERIES AMP Code ‘HF’ SuFFIx HAlOgEN FREE ITEM PACKAgINg Code The dot is poisitioned before the Pack- aging Suffix with whole ratings and within the numbering sequence for fractional ratings. Refer to Amp Code column in the Electrical Specifications table. NR = Tape and Reel, 5000 pcs Example: 1.5 amp product is 046801.5NRHF (2 amp product shown above).