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Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 5

Technical content

Features

Applications

  • RoHS compliant, lead-free and halogen free
  • Fast response to fault currents
  • Compact design saves board space
  • Low resistance
  • Low-profile
  • Compatible with high temperature solders
  • 0402 size- the smallest PPTC in the market compatible with high temperature solders
  • USB peripherals
  • Disk drives
  • CD-ROMs
  • Plug and play protection for motherboards and peripherals
  • PDAs / digital cameras
  • Game console port protection
  • Tablet and Notebook PCs
  • E-readers Agency Approvals

Electrical Characteristics

(A) I trip (A) V max (Vdc) I max (A) P d typ. (W) Maximum Time To Trip Resistance Agency Approvals Current (A) Time (Sec.) R min (Ω) R 1max (Ω) I hold = Hold current: maximum current device will pass without tripping in 20°C still air. I trip = Trip current: minimum current at which the device will trip in 20°C still air. V max = Maximum voltage device can withstand without damage at rated current (I max) I max = Maximum fault current device can withstand without damage at rated voltage (Vmax) P d = Power dissipated from device when in the tripped state at 20°C still air. R min = Minimum resistance of device in initial (un-soldered) state. R 1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow soldering of 260°C for 20 sec. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. WARNING

  • Users shall independently assess the suitability of these devices for each of their applications
  • Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire
  • These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration
  • Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices
  • These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses
  • Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. AGENCY AGENCY FILE NUMBER E183209 R50119118 Additional Information Datasheet SamplesResources Samples

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > 0402L Series T emperature Rerating T emperature Rerating Curve -40 -30 -20 -100 10 20 30 40 50 60 70 80 10% 30% 50% 70% 90% 110% 130% 150% 170% Temperature (°C) Percentage of Rated Current Average Time Current Curves The average time current curves and Temperature Rerating curve performance is affected by a number or variables, and these curves provided as guidance only. Customer must verify the performance in their application. Note: Typical Temperature rerating curve, refer to table for derating data Ambient Operation Temperature -40°C -20°C 0°C 20°C 40°C 50°C 60°C 70°C 85°C Part Number Hold Current (A) Current in Amperes Time in Seconds Time-to-T rip Curve A-0402L010SL B-0402L020SL C-0402L035SL D-0402L050SL 0.00 0.10 10.00 0.01 1.00 0.10 1.00 10.00 100.00 Fault Current (Amp.) Time to Trip (Sec.) A B C D

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > 0402L Series Environmental Specifications Operating/Storage T emperature -40°C to +85°C Maximum Device Surface T emperature in T ripped State125°C Solvent Resistance MIL–STD–202, Method 215 No change Vibration MIL–STD–883, Method 2007 , Condition A No change Moisture Sensitivity Level Level 1, J–STD–020 Physical Specifications T erminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets ANSI/J-STD-002, Category C. Soldering Parameters Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone tL to tP Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TS(max) to TP) 3°C/second max Pre Heat: Temperature Min (Ts(min)) 150°C Temperature Max (Ts(max)) 200°C Time (Min to Max) (ts) 60 – 180 secs Time Maintained Above: Temperature (TL) 217°C Temperature (tL) 60 – 150 seconds Peak / Classification Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > 0402L Series Part Ordering Number System PACKAGING STYLE L: LITTELFUSE SURFACE MOUNT PPTC QUANTITY CODE R: Tape & Reel K: 10000

0402 L xxx K R - A

(Refer to Electrical Characteristics Table) -A: Automotive grade Blank: Standard version Packaging Dimensions Part Number Ordering Number I hold (A) I hold Code Packaging Option Quantity Quantity & Packaging Codes 0402L010SL 0402L010SLKR 0.10 010 Tape & Reel 10,000 KR 0402L020SL 0402L020SLKR 0.20 020 10,000 KR 0402L035SL 0402L035SLKR 0.35 035 10,000 KR 0402L050SL 0402L050SLKR 0.50 050 10,000 KR Part Number Device Dimension Solder Pad A B C D E F G H inch mm inch mm inch mm inch mm inch mm inch mm inch mm inch mmMin Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max C Device Top and Bottom Marking and Dimensions are Similar Side View D E A B Device Dimensions FF Solder Pad Layout HG

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > 0402L Series T ape and Reel Specifications T ape and Reel Diagram W CD H Reel Specifications W1F W4 W3 T ape Specifications Tt Pd Ct Ps Pw Ph Dd Ds Tw TAPE SPECIFICATIONS: EIA- 481-1 (mm) REEL DIMENSIONS: EIA-481-1 (mm) 0402L010SL 0402L020SL 0402L035SL 0402L050SL C t 0.05 ± 0.01 H 12.0± 0.5 Dd 1 .5 ± 0.1 W 9.0 ± 0.5 Ds 4.0± 0.1 D Ø60 ± 0.5 Pd 0.41± 0.1 F Ø13.0 ± 0.2 Ph 1 .12± 0.1 C Ø178 ± 1 Ps 2.0 ± 0.1 W1 2.2 ± 0.5 Pw 0.65 ± 0.03 W2 3.0± 0.5 Tt 0.61 ± 0.1 W3 4.0 ± 0.5 Tw 8.0 ± 0.1 W4 5.5 ± 0.5 Leader min. 390 W4 5.5+0.5 Trailer min. 160 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.